Used KLA / TENCOR 2367 #200219 for sale

KLA / TENCOR 2367 is a sophisticated equipment designed to analyze wafer substrates and reticles used in the production of integrated circuits (ICs). This advanced machine inspects the various components within and around each reticle for surface defects, shape irregularities, and electrical defects. KLA 2367 also provides users with a detailed report on the state and integrity of each wafer being tested. TENCOR 2367 is designed for use in semiconductor production lines. It combines an array of different imaging and inspection technologies, such as charge-coupled device (CCD) and X-ray imaging, energy dispersive X-ray spectroscopy (EDS) and scanning electron microscopy (SEM). These technologies feed into an automated data acquisition system, which collects detailed information about the electronic and structural features of each mask and wafer being inspected. The inspection process begins with a thorough scanning of each wafer surface. 2367 then isolates potential defects, such as voids, cracks, scratches, and pinholes. It then uses the CCD and X-ray imagers to identify the exact location of each defect. KLA / TENCOR 2367's high-resolution SEM and EDS capability is used to scan for electrical defects. It detects irregularities in transistor masks, and distances between wiring patterns. Once all defects have been identified, the unit compiles and analyzes the data before outputting a comprehensive report on the state of each inspected wafer. Critical information can be extracted from the inspection report, including defect size, location, severity, and probable environmental or mechanical causes. KLA 2367 is designed to provide detailed analysis of the entire wafer surface area. It offers reliable detection of patterned and non-patterned defects, and sets the standard for inspection quality and accuracy. With its global support machine and well-established service network, TENCOR 2367 is the ideal choice for semiconductor manufacturers facing the challenge of producing high-end devices for challenging use cases.