Used KLA / TENCOR 2367 #9197191 for sale
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ID: 9197191
Wafer Size: 12"
Vintage: 2007
Inspection system, 12"
Wafer calibration kit include DSW / Shiny
Carrier ID HW Options
KEYENCE BCR single wire (2 CID devices)
Safety interlocks:
Open panel
Lamp
Facilities:
Power: 208V, 3 phase
Vw: 25 in Hg
CDA: 5 Sft/min
Exhaust: 600 ft3/min
Exhaust: 100 ft3/min
Exhaust: 1300 ft3/min
Integrated mini environment included
FEC Computer system with the following minimum features:
Intel pentium 4 CPU 3.00GHz
504MB memory (RAM)
Dell computer
Intel xeon CPU 3.4GHz
2GB Memory (RAM)
DVD-ROM
Mouse
Keyboard
IDM
InlineADC
ITF
Load port UI
MDAT
Mixed mode
NFS Data transfer
HSMS / GEM Semi E37 compliant ethernet interface:
HSMS (E5 / E30 / E37)
GEM/SECS Automation interface (E4 / E5 / E30)
SEMI E84
SEMI E116
Hokuyo sensors for use with:
Overhead transport (OHT)
Remote guided vehicles (RGV/AGV)
Auto switch for dual use environments
Basic automation package: E39, E87, E90 (Carrier management/wafer tracking)
Advanced automation package E40. E94 (Process job, control job)
Spatial population analysis:
Power options
Array segmentation
Patch images: 64x64
Pixel perfect
RBB
RBMT
Sensitivity tuner
NPA
Photo option:
FEM
PWQ
Interface:
Data transfer
DVD-R
Ethernet
23XX Options :
Pixel size:
Visible: 0.25/0.39/0.62
IV Broadband & narrowband: 0.12/0.16/0.20
Full sky: 0.12/0.16/0.20
Edge contrast: 0.12/0.16/0.20
Hardware optic :
BB Visible pixels (0.62 mm, 0.39 mm, and 0.25 mm)
BB/I-Line/G-Line UV pixels (0.20 mm, 0.16 mm, and 0.12 mm)
Edge contrast
1600 MP PS Image computer
Array / Random modes
High mag review optics
Anti-blooming TDI
High resolution review camera
General system info:
Loading configuration: FOUP
(2) Cassette
(2) FOUP Positions
System on-line: Yes
Line conditioner: Yes
Cables: Yes
Fan module: Yes
Shipping brackets installed upon deinstall: Yes
GEM/SECS Interface: Yes
Hard disk: 876G
Currently stored in cleanroom
2007 vintage.
KLA / TENCOR 2367 is an automated mask and wafer inspection equipment designed for the chip fabrication industry. It combines advanced imaging, interferometry and microscopy technologies, to provide unmatched image accuracy and performance. The system includes a tool-level workcell that houses a digital image projection device with various configurable parameters. KLA 2367's integrated five-axis kinematics allows for high precision movement of the projection device and sample across three axes while maintaining the same focus. TENCOR 2367 utilizes bright-field, dark-field, and polarizing illumination to provide both contrast and reflectivity to enable edge detection and mapping of a wide range of defect types, including edge defects, fine line disconnects and misalignment defects. 2367 also employs advanced algorithms for contrast enhancement, blocking and clustering, image segmentation and mapping which enable the detection of the most subtle anomalies. The unit uses advanced image filtering techniques, such as defect classification, noise reduction, and false color contrast to further reduce the number of false alarms and ensure the highest accuracy of wafer inspection. On the tool level, the machine includes a user interface software package with customizable interface, setup, inspection/calibration, defect review, and process optimization capabilities. The user interface combines intuitive controls with a graphical display and multi-language support. The user interface includes quick and easy image review, defect sizing and location mapping with various reporting capabilities. Reports can be customized and exported in industry standard formats for easy data sharing and storage. KLA / TENCOR 2367 is designed for accuracy and reliability, providing functionalities to help users perform defect diagnosis, review and processing quickly and efficiently. With its flexible, modular design and integrated software, KLA 2367 is an essential tool for wafer and mask inspection applications.
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