Used KLA / TENCOR 2367 #9226903 for sale
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ID: 9226903
Wafer Size: 12"
Bright field patterned inspection system, 12"
(2) Load ports with FOUP capable (ASYST)
RFID Type: Load ports carrier reader
Robot: YASKAWA
Light source: 350 W Hg-Xe illumination
Image process system: TDI (3200MPPS)
Resolution: 120 nm
Pixel size: 0.12, 0.16, 0.20, 0.25, 0.39, 0.62 um
Special function: Edge contrast illumination mode
Light mode:
I-Line
G-line
Broadband UV
Visible
User interface
Power condition
Missing parts:
Qty Part no Description
(16) 0076508-000 Tested, SDB1600 MPX, v2 (Sensor daughter boards)
(1) 0279583-000 FRU assy, amplifier, stage,z
(1) 0093388-001 Tested, PSB 3200 MPX, boards b(DC to DC board)
(1) 730-774350-001 Cable, mac-d to x flex signal
(5) 0086079-002 Tested, input data adaptors (IDA PCB)
(1) 0031224-003 Assy, filter wheel,236x
(1) 730-733835-001 Cable, mac to mac-d power
(1) 730-772676-002 Cable, pneumatic solenoid pigtail
(1) 0095782-000 Assy, fiber optic node 0 to 5
(1) 0095784-000 Assy, fiber optic node 2 to 6
(1) 0095785-000 Assy, fiber optic node 3 to 7
(1) 0095787-000 Assy, fiber optic node 4 to 8
(1) 0095789-000 Assy, fiber optic node 5 to 9
(1) 0095791-000 Assy, fiber optic node 6 to 10
(1) 0095792-000 Assy, fiber optic node 7 to 11
(1) 0103943-000 Assy, fo, TDC 0 out, CRTA to node 0-1
(1) 0103944-000 Assy, fo, TDC 1 out, CRTA to node 2-3
(1) 0103945-000 Assy, SGB out to R tap
(1) 0095216-000 Net gear 24 ports net switch plus mounting bracket in UI box
(1) 0115395-000 Upper, monitor (VDU) in UI
(1) 0119930-000 G5 x-server R tap (APPLE Image system)
(4) 0101705-000 Assy, tested, G5 x-server nodes
(2) 0276654-000 FRU assy, tested power supplies, m31 host/n
(1) PN Unknown Trackball mouse on UI unit
(1) 0083821-000 Line conditioner (Mains transformer)
(3) 0298771-000 Image computer (APPLE) hard discs
(6) 0066560-000 SCC DELL Computer hard discs.
KLA / TENCOR 2367 is a fully automated, non-contact mask and wafer inspection equipment. It is designed for defect detection, critical dimensional measurement, and monitoring of pattern layout on photomasks and wafers. The system utilizes advanced pattern recognition and proprietary optics to spontaneously identify both planar and 3D defects on both the front and back sides of the masks and wafers. It also features an intuitive, easy-to-use software interface that enables both experienced and novice users to quickly and efficiently program and monitor process optimization. The unit can be configured to accommodate a variety of parts, including wafers as small as 4-inch to as large as 12-inch and masks as small as 4-inch to as large as 25-inch. KLA 2367 uses a high-speed LED source to achieve maximum throughput while also allowing an inspection speed of 8 micrometers per second for both front and backside inspection. The machine also features an advanced image enhancement that includes focus control, gain control, and alignment correction. Additionally, TENCOR 2367 has a specialized illumination tool designed to significantly reduce the amount of wafer and mask rotation required to inspect for defects. This feature also eliminates potential defects that can arise from prolonged exposure to the inspection light. In addition to its superior optics and advanced pattern recognition, 2367 offers a variety of automated software and data analysis, including statistical process control (SPC), defect classification, and post-review tools. This enables the asset to detect and log critical defects with great accuracy. The software also includes a comprehensive report generation feature that provides customizable reports suitable for both traceability and statistical analysis. The model also features a "Point & Look" module that allows a user to quickly and easily pinpoint and inspect specific locations on the mask and wafer. This eliminates the need for manual microscopy or other techniques, allowing for faster analysis and greater accuracy. Furthermore, KLA / TENCOR 2367 equipment can be integrated with other devices, allowing for a comprehensive, automated analysis process. Ultimately, KLA 2367 provides unmatched defect detection and critical dimensional measurement, allowing for the inspection of a wide range of photomasks and wafers.
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