Used KLA / TENCOR 2367 #9248827 for sale

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ID: 9248827
Wafer Size: 12"
Bright field patterned inspection system, 12" With turnkey (2) Load ports with FOUP capable (ASYST) RFID Type: Load ports carrier reader Robot: YASKAWA Light source: 350 W Hg-Xe illumination Image process system: TDI (3200MPPS) Resolution: 120 nm Pixel size: 0.12, 0.16, 0.20, 0.25, 0.39, 0.62 um Special function: Edge contrast illumination mode Light mode: I-Line G-line Broadband UV Visible User interface Power condition.
KLA / TENCOR 2367 is a mask and wafer inspection equipment designed for the semiconductor industry. It is a high-precision imaging and inspection system used to detect potential defects in critical layers of a 19nm semiconductor mask or wafer. KLA 2367 includes two inspection technologies to ensure accurate and comprehensive defect detection. The first is vacuum ultraviolet (VUV) technology. This uses proprietary diffraction-based imaging techniques to map out defects in the mask or wafer. VUV optics are driven by air to eliminate the need for liquid nitrogen cooling, reducing the unit's overall maintenance requirements. The second inspection technology employed by TENCOR 2367 is spectrum imaging (SI), which provides photometric images for analysis. This uses an intensity and color-specific technique to detect particles, scratches, and other defects in the sample. The SI technique relies on the manipulation of light from different spectral components to generate visible images of the defects. To produce high-resolution images, 2367 uses proprietary optics and signal processing techniques to detect potential defects, even in the most challenging micro-structures. Its powerful software features include powerful defect detection capabilities, statistical mapping, and pattern recognition. KLA / TENCOR 2367 also has unique modules for die-to-die inspection and inspection of bumpy structures. The die-to-die inspection module features a highly accurate die-comparison engine for detecting minute die-level aberrations. This helps ensure product quality and yield improvement. The bumpy structure module is capable of detecting defects in untrimmed wafer-level devices, enabling increased yield in aggressive processes. The instrumentation of KLA 2367 machine is powerful and includes a motorized wide-field camera, a scan motor, a precision scanning cradle, and a high-resolution laser inspection optics tool. The asset also includes environmental and safety features such as electrostatic discharge, which can protect sensitive components and minimize errors in inspection. Overall, TENCOR 2367 provides a powerful and comprehensive mask and wafer inspection solution. With its advanced imaging, inspection, and environmental features, the model is capable of providing superior performance, accuracy, and reliability.
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