Used KLA / TENCOR 3200-1226-03 #9294184 for sale

KLA / TENCOR 3200-1226-03 is a wafer and mask inspection equipment which is capable of delineating lithography features, defects, and metrology on semiconductor wafers and masks. It is a hyperflexible, high-resolution system designed to support the full wafer, reticle, and mask manufacturing process. KLA 3200-1226-03 has powerful imaging capabilities, able to zoom from fields of view up to 200mm x 200mm to features as small as 1 micron. It also has automated alignment with 20 nm accuracy, which helps reduce time spent manually aligning wafers and masks during inspection. It also includes improved defect detection sensitivity, due to the improved light balance technology and lighting ramp-down protection. This unit ensures that defects are more readily detectable and therefore more efficiently addressable. The machine consists of a multi-beam laser scanning station which contains the Digital Video Processor (DVP), a high resolution dual-zone camera, a fiber array imaging tool, and a Projection Alignment Asset (PAS). The multi-beam laser scanning station is capable of inspecting both wafer and reticle masks at a speed of up to 50 wafers each hour, thereby providing increased throughput as compared to single layer systems. The multi-beam technology also provides significantly faster inspection at different depths of field. The Digital Video Processor (DVP) is capable of support for both Advanced Pattern Recognition (APR) and feature-oriented Inspection (FOI) technologies. This allows for more detailed and reliable defects detection and simplifies the usage of advanced inspection techniques. The high resolution dual-zone camera allows for more advanced algorithms to be used in order to detect defects over a larger area. This results in both improved sensitivity to defects, as well as increased inspection speed. The fiber array imaging model is designed to support multiple illumination methods for increased detection of different types of defects. It can also be used to inspect multiple images simultaneously, and is compatible with both blue and UV illumination. These features are complemented by the Projection Alignment Equipment (PAS), which provides precise and rapid automatic alignment of wafer and reticle images. This helps to speed up the process of inspecting wafers and masks significantly. To summarise, TENCOR 3200-1226-03 is an advanced wafer inspection system, capable of quickly and accurately detecting defects across a broad range of fields. Its main features include multi-beam laser scanning, Digital Video Processor, high resolution dual-zone camera, fiber array imaging unit, and Projection Alignment Machine. These features together make this tool an optimal solution for inspecting wafer and masks.