Used KLA / TENCOR Archer 200 #293800299 for sale

KLA / TENCOR Archer 200 is a next-generation wafer and mask inspection tool that is designed to enable Advanced Metrology inspection of semiconductor manufacturing. It is equipped with a proprietary "scanning electron optics" and proprietary "full-field photomask alignment" technologies to provide unmatched imaging capabilities for critical process control and yield optimization. KLA Archer 200 equipment employs a combination of sub-micron resolution electron/ion/optics contrast imaging and advanced metrology to inspect wafer and mask out-of-specification defects such as particle contamination, lithography errors, and photomask alignment errors. It is designed to provide high-throughput, high-resolution imaging and inspection of mask and wafer defects. The system's electron/ion optical capabilities allow for precise imaging of out-of-specification defects with high magnifications up to 70,000x. This imaging resolution is essential for precise particle contamination and particle defect analysis (PCD/PDCA) applications, as well as process control and vertical hot-spot analysis. Advanced metrology capabilities integrated into TENCOR Archer 200 inspects patterned and unpatterned features on both photomasks and wafers. It can detect defects on the order of 0.01µm to 0.1µm in size, including those too small to be detected with traditional optical technologies. For photomask inspection, Archer 200 includes the industry's most advanced full-field photomask alignment techniques. This patented technology ensures precise alignment measurement over the entire field of view, eliminating errors caused by stitch/positioning errors. The unit is also capable of simultaneous throughput and die-to-die inspection, reducing cycle time and providing a higher yield. Overall, KLA / TENCOR Archer 200 is an advanced mask and wafer inspection machine, engineered to meet the most stringent industry standards and yield requirements. Its industry-leading features and advanced scanning capabilities provide unmatched imaging resolution and yield optimization capabilities especially critical in advanced process control and lithography applications.