Used KLA / TENCOR Archer AIM+ #9144983 for sale

KLA / TENCOR Archer AIM+
ID: 9144983
Vintage: 2006
Overlay inspection system 2006 vintage.
KLA / TENCOR Archer AIM+ is an automated mask and wafer inspection equipment that provides high-definition imaging, advanced measurement accuracy and high throughput for advanced device development. The system combines advanced mask and wafer inspection technology with advanced algorithms to provide an efficient, automated process that significantly improves device yields. KLA Archer AIM+ unit utilizes bright field and dark field imaging technology to detect defects on substrates including dies, masks and package tops. The bright field provides high contrast imaging for masks, packages and flip chips, allowing for quick inspection of defects and enabling accurate localized analysis. Dark field imaging is used for wafer images and scans, enabling the machine to detect defects on substrates with lower contrast. The tool performs automated alignment and focus scans of masks and substrates, and supports a wide range of metrology capabilities. It has automated defect classification, along with hardware-accelerated image zooming to support high accuracy and precision. The asset delivers fast image processing speeds, allowing for shorter runtimes and faster turnaround times. It also optimizes speed and accuracy for multiple defect types, such as particle defects, corner and pattern defects, narrow line defects and die shift detection. By automating the inspection process, TENCOR Archer AIM+ reduces labor cost and improves production efficiency. Its advanced algorithms, insight into the design process and intuitive navigation tools improve overall accuracy and yield. Additionally, Archer AIM+ comes with integrated analytics that provide insights into production data. These insights enable users to identify areas for improvement and optimize their processes for higher yield. Overall, KLA / TENCOR Archer AIM+ is an automated mask and wafer inspection model that provides high-definition imaging, advanced measurement accuracy and high throughput, improving device yields. It helps optimize device manufacturing with its fast processing speeds and automated defect classification, along with intuitive navigation and analytics integration.
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