Used KLA / TENCOR Candela CS20 #293794286 for sale

ID: 293794286
Wafer Size: 2"-6"
Vintage: 2008
Surface measurement system, 2"-6" Thickness: 240-900 µm Cassette handling: 150 mm Dual cassette for wafer sorting Illumination source: Laser: 50 mW Wavelength: 405 nm Operator interface: Trackball Standard keyboard Operating system: Windows XP 2008 vintage.
KLA / TENCOR Candela CS20 is a comprehensive mask and wafer inspection equipment designed to facilitate rapid defect inspection. The system is equipped with a wide field of view designed for high throughput, with up to 1000 wafers per hour. Its high resolution 10.5 μm pixel pitch detector ensures maximum inspection coverage and accuracy. KLA CANDELA CS-20 delivers accurate and reliable defect detection and pattern overlay measurements. The unit's high-precision positioning machine enables its surface-mapping technology to accurately measure the topography of patterned devices. Its cutting-edge multilayer alignment control adjusts the stage positioning to ensure precise overlay measurements. TENCOR CANDELA CS 20 provides highly efficient automation for critical fab processes. It boasts an automated multi-die alignment tool for quick set up of a single die or multiple die inspection jobs. The asset's instrument-level automation helps to reduce cycle times and ensure consistent, repeatable results. Its visual defect classification (VDC) enables users to accurately and quickly identify complex, intermittently occurring, and hard-to-detect defects. The model is easy to maintain and customize for the production environment. Its intuitive user interface includes powerful windows-based software for easy setup, data management, and field service. A real-time fault detection equipment alerts operators immediately when hardware or connectivity issues occur. To ensure optimal reliability and accuracy, KLA / TENCOR CANDELA CS-20 is equipped with a full suite of optical inspection capabilities and quality assurance measures. Its low-kV inspection ensures precise defect detection and oxidation isolation. Its Wiener deconvolution imaging enables increased defect detection using higher wafer throughput while maintaining high quality images. An innovative 180-degree reverse-angle imaging enhances bright-field imaging and improves hard-to-find defect detection. In addition, Candela CS20 supports an industry-leading metrology suite consisting of automated device, waveguide, and structure measurement capabilities. With its long-wavelength inspection mode, the system automatically identifies devices at the deepest layers. CANDELA CS-20 is a reliable and highly advanced mask and wafer inspection unit that performs dependable and efficient pattern recognition and overlay. Its highly automated machine provides superior performance and caters to a variety of applications.
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