Used KLA / TENCOR Candela CS20 #9389552 for sale

Name: KLA / TENCOR Candela CS20
Brand: KLA / TENCOR
SKU: 9389552
Availability: SoldOut

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Mask & Wafer Inspection

Manufacturer

KLA / TENCOR

Model

Candela CS20

ID: 9389552

Vintage: 2012

Surface measurement system, 2"- 8" Thickness: 350 µm to 1,350 µm Defect sensitivity: 0.08 µm Diameter PSL Sphere equivalent: ≥ 95% Capture rate Surface topography: >2Å Ra sensitivity Parameters: Ra, Rq, Wa, Wq Film thickness uniformity (Single layer): 5Å <Thermal oxide < 1000Å Depth of focus: Maximum ±15 µm under bow Repeatability: CV ≤ 5.0 % Edge exclusion: Imaging (No exclusion) Defect analysis, varies with wafer size (Nominal: 2"= 1.5mm, 8"= 5mm) Defect types: Particles Scratches Stains Pits Bumps Scratches: 100 µm long, 0.1 μm wide, 50Å deep Pits: 20 µm Diameter, 50Å deep Stains: 20 µm Diameter, 10Å thick Illumination source: 50 mW Laser 405 nm Wavelength R-Θ Coordinates Coordinate precision: 80th percentile ≤150 µm Coordinate accuracy: 80th percentile ≤150 µm Spatial resolution: Minimum ≥ 10m spacing at outer edge of 8" Single channel particle measurements Robotic wafer handler, 2"- 8" Operator interface: Trackball and keyboard LCD Monitor, 19" 2012 vintage.

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KLA / TENCOR Candela CS20 is an advanced automated mask and wafer inspection equipment designed to provide groundbreaking resolution and repeatability to semiconductor manufacturers. The system utilizes blue light LED and proprietary imaging optics to achieve unparalleled clarity when inspecting wafers and masks down to a 5 nanometer resolution. KLA CANDELA CS-20 is equipped with several advanced features, such as integrated air-bearing scanning stages, pulsed beam quadrant illumination, and automated defect classification, that together produce high-contrast images for the most thorough and accurate inspection possible. The optical unit provides both surface and cross-sectional image data that is used to detect surface defects such as particles, contamination, and pinholes. An in-line automated defect classification machine also enables identification of different defect types and categorization according to severity. This not only reduces practitioner error but also maintains a high level of consistency between inspection results. TENCOR CANDELA CS 20 also employs advanced pattern matching algorithms to identify potential defects, as well as automated defect cluster analysis to identify repeatable defects on multi-die wafers. Results are presented in a graphic, easy-to-navigate format, and it's possible to move the image in both x and y axes to target problem areas. The tool also allows for target and isolate images from lateral, aerial, and cross-sectional perspectives. Moreover, data collected from the asset offers users the ability to verify the accuracy of process steps such as deposing and patterning. The data can be stored and stored in a centralized library for retrieval, making it ideal for long-term defect analysis and process tracking. The library can also be used to compare captured images with desired results for pattern matching. CANDELA CS-20 is a revolutionary model for wafer and mask inspection that provides the most reliable and repeatable results. By combining proprietary optics with integrated air-bearing stages, pulsed beam illumination, and automated defect classification, the equipment ensures that users stay a few steps ahead of the most demanding today's advanced metal hard mask and wafer inspections.