Used KLA / TENCOR Candela CS20R #9148287 for sale

ID: 9148287
Wafer Size: 2"-8"
Surface measurement system, 2"-8" Stains: 20um Dia, 10Å Thickness Parameters: Ra, Rq, Wa, Wq Film thickness uniformity: 5Å <Thermal oxide <1000Å Repeatability: CV ≤ 5.0% Illumination sources: 50 mW Laser 405 nm Wavelength Operator interface: Trackball Keyboard Power: 220 V, 60 Hz, 1 kW Air pressure: 95~110 PSI Air flow rate : 2 CFM 1/4" OD, 3/16” ID Includes: Polyurethane tube.
KLA / TENCOR Candela CS20R is a mask and wafer inspection equipment designed to reliably find defects in both single-layer and multilayer photomasks and wafers. The unique 3-D imaging technology of the system features ultra-sharp optics and up to 45µm resolution, allowing for highly accurate detection of even the smallest defects. At the heart of the CS20R is a patented 5 megapixel CCD inspection sensor. This sensor features a dual-light unit, combining visible and infrared illumination, allowing for enhanced contrast and better defect detection. The machine also features a large field of view that is over 45 times larger than conventional systems, enabling large area inspection without the need to scan multiple times. The CS20R also features a user-friendly software interface which makes operation of the tool simple and intuitive. It features a comprehensive suite of pattern recognition and analysis tools, which allow users to scan both single-layer and multi-layer specimens quickly and accurately. The CS20R also integrates with multiple software kernels for specific tasks, such as defect classification, validation and review. In addition to its technologically advanced features, the CS20R is built on a powerful and reliable platform, allowing for exceptionally reliable operation and maintenance in busy production environments. It has been designed for continuous operation, meaning virtually no downtime, and the asset is upgradable with a range of hardware and software options. Overall, KLA CANDELA CS 20R is an incredibly powerful and reliable model for mask and wafer inspection. The unique 3-D imaging technology of the equipment, with its dual-light system, allows for the detection of even the smallest defects. The unit is also built on a robust platform, allowing for reliable operation in busy production environments, and comes with a range of automated pattern recognition and analysis tools which make operation of the machine simple and intuitive.
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