Used KLA / TENCOR Candela CS20V #9293251 for sale

KLA / TENCOR Candela CS20V is a mask and wafer inspection equipment designed to meet the demanding requirements of mask and wafer inspection in semiconductor manufacturing. The system achieves unprecedented level of precision and repeatability with advanced image acquisition and processing algorithms. KLA CANDELA CS 20 V utilizes high-resolution imaging technology for imaging mask features as small as 0.5 μm. It combines deep ultraviolet (DUV) and visible light imaging,which allows the unit to detect both under- and over-etched features. The imaging optics is optimized for highest resolution and low noise levels, with a dynamic range of up to 1000:1. The machine utilizes advanced defect detection algorithms to accurately identify defects on both masks and wafers. Defects can be detected as small as 0.2 μm and can be classified according to type and size. It provides both false-alarm reduction and enhanced throughput via a combination of defect prioritization, automate stage-scanning, and image enhancement techniques. In addition to defect detection, TENCOR CANDELA CS 20-V also provides a wide range of process characterization capabilities. It provides full wafer topography analysis capabilities, allowing for measurement of feature profile, film thickness, step heights and etch depth. Advanced critical dimension (CD) measurements are also supported, with the tool able to measure and analyze corner-rounded, 45° sidewall, and over-etched features. CANDELA CS-20 V is designed for ease of use and robustness. It is housed in a stainless steel enclosure and features an intuitive user interface with customizable menus, easy access to asset settings, and a touch screen display. The model is capable of field upgradeable components, which allows for easy equipment reconfiguration and provides a high level of modularity. KLA / TENCOR CANDELA CS 20 V is an advanced and powerful mask and wafer inspection system designed for use in the most demanding semiconductor manufacturing applications. Its combination of high resolution imaging technology, advanced defect detection algorithms, and process characterization capabilities enable the unit to provide highly accurate results with high throughput and repeatability.