Used KLA / TENCOR eS32 #9354572 for sale

KLA / TENCOR eS32 is an advanced mask and wafer inspection equipment that takes advantage of a uniquely designed active imaging head and the latest in imaging sensors to deliver higher quality, faster inspection times, and improved defect placement accuracy. The system is designed to provide industry-leading throughput, yield and critical dimension (CD) accuracy to solve the rapidly increasing demands from the latest chip technologies. The unit's advanced active imaging head contains two full-width 2k x 2k camera sensors mounted on opposite sides of the optical components for simultaneous 2D imaging in both parallel illumination and shadowed illumination modes. This offers both the imaging and non-imaging capabilities needed to detect defects and features at a wide range of angles, helping to reduce rework costs. The machine also includes advanced sensors for wafer-level CD control and high-resolution flat-field/connectivity metrology to support wafer and advanced packaging technology companies. The Enhanced Solder Inspection (ESI) feature is designed to identify solder voiding on wafers and substrates with an accuracy of 1% or less. KLA eS32 employs the latest in high-resolution imaging technology, which enables it to capture 256x256 pixel images at a rate of 1 to 4 images per second across all product types in both single-face and multi-face configurations, achieving optimum throughput and a small footprint. The tool also supports 3D reconstitution and texture recognition, which allows for automated defect classification and leveling with a high degree of accuracy, and as a rule-based inspection asset, it can easily be configured to adhere to various customer procedures and standards. In addition, TENCOR ES 32 is capable of scanning large-area wafers, enabling it to improve quality and yield by detecting more types of defects than standard optical systems. The combination of advanced high-resolution sensors, reconstitution and texture recognition algorithms, with a rule-based inspection approach, provides high-precision inspection capabilities, resulting in high defect detection rate and high throughput. The model is fast and accurate, enabling it to quickly assess the quality of the wafer or chip before it goes into production.