Used KLA / TENCOR / ICOS CI-T130 #293665172 for sale

ID: 293665172
Lead scanner MMI Version: 8.3a Handler version: 3.4f MVS Version: MVS7000 (7) PnP heads Function: QFP, TSOP, BGA, QFN 3D: CCD: IVC-4000 Lens (QLM): RLM 2D: CCD: IVC-4000 Lens (RLM): RLM IS2 Top Mark: CCD: IVC-4000 Lens: 45mm Normal top plate module TTH (component heigh module) QFN module Slot 2: MVS7000 Slot 4: MVS7000 Operating system: Windows XP.
KLA / TENCOR / ICOS CI-T130 is an automated mask and wafer inspection equipment designed for the semiconductor industry. It provides comprehensive defect detection, inspection, and analysis capabilities for a wide range of wafer types, including advanced nodes. It is capable of detecting both extremely small defects and common failure modes such as bridging and nodules. The system uses a combination of different imaging technologies, including high-resolution bright-field imaging, dark-field imaging, and reflection imaging. Each image is analyzed by specialized algorithms that are optimized for each type of defect. This allows for both accurate and efficient detection of local defects as small as 20nm. KLA CI-T130 also offers a highly configurable, user-friendly interface that allows operators to quickly and easily set up the unit for different wafer types, chip sizes, and feature sizes. It also provides a robust set of analysis tools for further analysis of the data acquired from each wafer. ICOS CI-T130 is equipped with a high-powered optical microscope that allows for more detailed analysis of defect sites. This allows for defect analysis with the highest resolution available, enabling users to accurately detect and categorize defects that are difficult or impossible to see with conventional wafer imaging tools. The machine is further integrated with KLA Hi-YieldDefect Analysis (HiModel) software package, which provides quick and easy data mining, statistical process control (SPC) analysis, and particle size measurement capabilities. This allows customers to quickly compare defect data with past results and increase their process reliability through engineering process control. TENCOR CI-T130 is designed to maximize throughput, and has a cycle time of 30 minutes for a full wafer scan. Its 85mm to 200mm wafer size range makes it compatible with the latest wafer sizing standards. The tool includes various safety features, such as a UV safety interlock, to protect the user and the asset from UV damage. Overall, CI-T130 is a versatile mask and wafer inspection model that provides users with a comprehensive and accurate defect inspection process, enabling them to achieve the highest levels of quality control for their products.
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