Used KLA / TENCOR LWS 3000 CFI #293608931 for sale
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KLA / TENCOR LWS 3000 CFI is a computer-equipped mask and wafer inspection equipment designed for use in a wide variety of semiconductor production processes. The system consists of a main inspection tool, a high-speed, high-resolution imaging unit, a high-speed imaging and motion control subsystem, an integrated vision subsystem, and an array of display, analysis and metrology tools. The primary function of KLA LWS 3000 CFI is the inspection of fine and ultrafine-line resolution images of both opaque and transparent objects such as masks, wafers and other photomasks. The machine has the capability to measure and compare extremely small objects and features with submicron accuracy. This allows for extremely high levels of defect detection, defect resolution and throughput. The high-speed imaging tool employs multi-channel laser interferometry and multi-wavelength electrically detected phase, polarization and chromatic contrast imaging. This provides real-time 3D, tomographic and interferometric measurements of feature height, width, depth, tilt and z web. The motion control subsystem provides the capability to track and correct small motions on the order of fractions of a micron. This ensures superior results in difficult defects such as light saturation and line bridge differentials. The integrated vision subsystem combines digital imaging coupled with sophisticated algorithms to ensure defect location accuracy and reliable repeatability. An array of proprietary software tools provides a wide variety of features, including signal processing, automatic inspection and classification, defect marking, map-extension, image search, post-processing, metrics and report generation. This greatly enhances the imaging and metrology capabilities of TENCOR LWS 3000 CFI. LWS 3000 CFI is an advanced tool for semiconductor production processes and provides superior results for both small lot batches and high volume production needs. The asset is well-suited for mask and wafer inspections with extreme levels of accuracy, defects resolution, and throughput.
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