Used KLA / TENCOR SP1-DLS #9202491 for sale

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KLA / TENCOR SP1-DLS
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ID: 9202491
Wafer Size: 12"
Unpatterned surface inspection system, 12" Defect sensitivity on polished bare silicon: 0.050 µm Enhanced rough film sensitivity ARGON Ion laser: 488 nm Defect map and histogram with zoom RTDC (Real Time Defect Classification) Map to map Operator interface Mini environment platform ASYS Isoport ASYS Axys 21 Robot Vacuum system (Vacuum chuck) Option, Inmatch Haze Analysis Normalization Feature XY Coordinates Normal illumination Oblique illumination Source: Solid state power: 75 mW Wavelength: 488 nm Load port, 12" ASYST Dual FIMS Bulkhead (2) Advantag single wire CID Handlers Puck handling, 12" GEM / SECS And HSMS NFS Client (4) Color light towers Options: Bright field E84: Overhead load system E40 / E94 / E90 And AGV / RGV E87 (Based on E39) Operating system: Microsoft windows NT 4.0 CPU: Intel pentium III 997MHz RAM: 1 GB Blower unit.
KLA / TENCOR SP1-DLS™ is a fully automated, high resolution mask and wafer inspection equipment that utilizes advanced Digital Imaging and Computational Algorithms to identify defects on semiconductor masks and wafers. The system has the ability to detect both small and large area defects with size as small as 25nm. It is also capable of measuring line widths as small as 10nm. The unit has a robust 300mm inspection solution that is configurable depending on the job. KLA SP1 DLS has a large field of view of 6.4um and can be expanded up to 16um as needed. This helps to increase throughput and accuracy for large areas. It also features an optical zoom of up to 256x and an enhanced inspection speed of up to 100 points/second. The machine has the capability of performing both bright field and dark field inspections, enabling it to detect even smaller defects. TENCOR SP 1-DLS utilizes KLA proprietary measurement technology, which combines high accuracy and high resolution profile measurements with simultaneously acquired color images. This allows for the rapid recognition of a wide variety of defect types and helps in the selection of the most appropriate repair actions for each defect. The tool also contains a highly sophisticated defect visualization software that enables it to accurately select the best defect detection and repair algorithm based on the particular characteristics of the target wafer or mask. This helps to ensure that the asset meets the precise requirements of different jobs. The model also features 5 Axis alignment, which allows for quick and precise 3D measurements of various complicated geometries, such as patterns that are recessed or overlaid by other features. This feature reduces the total cycle time of the inspection process and helps to improve throughput. In addition to its advanced measurement and inspection capabilities, TENCOR SP1-DLS also features a wide range of integration and automation options, including automated light recipes, library building, recipe library, and advanced defect database. The equipment also contains both pre-process and post-process inspections to ensure that all defects found are accurately identified and repaired. Overall, TENCOR SP 1 DLS is a compact, high speed, and highly accurate mask and wafer inspection system, that allows for quick and reliable defect inspection and defect repair. The unit is capable of both high resolution imaging and high speed measurement, making it an ideal inspection solution for a wide range of applications.
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