Used KLA / TENCOR SP1-DLS #9211112 for sale
It looks like this item has already been sold. Check similar products below or contact us and our experienced team will find it for you.
Tap to zoom
Sold
ID: 9211112
Wafer surface analysis system, 12"
With backside inspection module
Includes:
Defect sensitivity: .050 um
Enhanced edge exclusion
Enhanced rough film sensitivity
Argon ion laser: 488 nm
(4) Dark field collection channels:
Normal wide
Normal narrow
Oblique wide
Oblique narrow
RTDC
Map to map
Measurement chamber with ULPA filter and blower unit
Operator interface
Operating system: Microsoft windows NT 4.0
Interactive pointing device
Keypad controls
TFT Flat panel display, 18"
Parallel printer port
Defect map and histogram with zoom
Microview measurement capability
Part number / Description
0042021-000 / Edge handling 12"
0042027-000 / Dual FIMS 12", bulkhead with backside inspection module, dual FOUP Handling module ASYST, edge handling, bulkhead mounted with dual UI, FLECWA
0025832-000 / 45A/250V, Domestic voltage requirement
547301 / Bulkhead UI, dual FIMS, SP1
571237 / System, DLS
571075 / Bright field, dual plane bright field, run simultaneously with dark field normal / Dark field oblique
515990 / XY Coordinate
570133 / 4 Color light tower
0028618-000 / Backside inspection option, backside inspection module requires edge handling
CALCURV-SPO3 / Cal curve oblique, 12"
543047-12 / SP1 DLS Conformance test document (CTD)
528080 / HSMS
RFE5-18036 / E87 Carrier management services
RFE55-20835 / E 40 / E 94 Process job management / Control job management and E 90 Substrate tracking
0043182-000 / Carrier ID hermos single wire
2002 vintage.
KLA / TENCOR SP1-DLS is a mask and wafer inspection equipment designed to provide quick, non-destructive analysis of masks and wafers. It is based on the MCD (Multi-Chromatic Differential Defect) system, which uses a combination of light and dark field views to detect small defects quickly and accurately. The unit is made up of several main components: the imaging optics, the imaging sensor, and the controller. The imaging optics includes three iris, two objectives, two filters and a microlens array board. These components work together to maximize the resolution and contrast of the samples being examined and are specifically designed to maximize the efficiency of the MCD-based detection. The optics also provide focus and magnification for precise image capture. The imaging sensor is positioned behind the optics and works in conjunction with the optics to capture the sample images. It is a line scan camera, which is capable of capturing up to 16 million pixels. This machine provides fast, high-resolution imaging for mask and wafer inspection. The controller is an advanced machine vision processor that is specifically designed to work with KLA SP1 DLS tool. It is responsible for managing the image capture, processing of the images, and reporting of results. It features push-button operation, fast image acquisition, and comprehensive defect reporting for increased accuracy and repeatability. TENCOR SP 1-DLS is a powerful and reliable tool for nondestructive mask and wafer inspection. Its MCD-based detection asset provides fast and accurate analysis of defects, while its comprehensive imaging optics and imaging sensor maximize the resolution and contrast of the images being scrutinized. The machine vision-based controller ensures quick and efficient image processing and detailed defect reporting. With all these components working together, KLA SP1-DLS model is perfect for applications that require fast, accurate inspection.
There are no reviews yet