Used KLA / TENCOR SP1-DLS #9214561 for sale

KLA / TENCOR SP1-DLS is a mask & wafer inspection equipment, designed for industry-leading defect detection and high-resolution imaging. The system offers unparalleled high-precision imaging for maximum defect coverage and contributes to the effective management of production and manufacturing costs. Additionally, the defect detection of the unit is the most sensitive and highest resolution with its advanced CMOS sensor, 12-bit A/D conversion, and resolution of 3.4 μm, nearly 500 times better than traditional inspection techniques. The machine includes integrated, high-speed image processing, wafer stage scanning, and real time results for evaluation and reporting. It has zero-beam-disturbance imaging technology, which helps in detecting and evaluating sub-resolution patterns. The tool also incorporates advanced analysis tools, such as image binarization, pixel value analysis, and classification. In addition, KLA SP1 DLS incorporates high-precision image stitching technology for defect review and printing. TENCOR SP 1-DLS is also designed to reduce downtime and increase efficiency. The asset has a patented "Go-To-Slice-Mode" feature, allowing users to quickly select wafers to be inspected. This improves throughput rates and reduces waste, leading to significant cost savings. The high-speed, low-noise analysis capabilities of the model make it more efficient than traditional tools. Finally, SP1-DLS provides a powerful suite of automated detection algorithms for the industry's most accurate inspection. These algorithms are designed to detect small critical feature defects, routine pattern discrepancies, and other anomalies. Additionally, the equipment has a user-friendly graphical interface that allows users to view a wide range of statistical information and to monitor the performance of the system. KLA SP 1-DLS mask & wafer inspection unit is ideal for producing the most reliable and accurate imaging results with maximum defect coverage. Its industry-leading features, such as zero-beam-disturbance imaging technology, high-resolution imaging, integrated image processing, and automated detection algorithms, make it an ideal option for high-precision inspection. The machine is also designed to reduce downtime with its fast Go-To-Slice-Mode feature, providing cost savings and superior throughput rates.