Used KLA / TENCOR SP1-DLS #9219037 for sale

KLA / TENCOR SP1-DLS
ID: 9219037
Wafer Size: 8", 12"
Vintage: 2004
System, 12" Process: Contamination detection CIM Hardware configuration: Main system: Main mini environment platform SMIF System: (2) ASYST IsoPort Handler system: ASYST Axys model 21 robot Options: Bright field Backside contamination (Edge handling system + flipper aligner) E84 Standard: Overhead load system Chamber components: ARGON Laser JDS uni-phase 75mW Chuck edgegrip Bright field option 2004 vintage.
KLA / TENCOR SP1-DLS is a next-generation mask & wafer inspection equipment specifically designed for backend semiconductor process inspection. The system utilizes advanced inspection technology to detect and identify defects on all layers of a semiconductor device with an impressive 99.99% accuracy. This unit is based on the award-winning Stealth DMD (Digital Micro-mirror Device), which gives it the capability to automate device inspection quickly and accurately. The Stealth DMD provides a wide swath of detection capabilities, including a 30,000 pixel imaging array that enables signal and defect inspection for all metal and interconnect layers, along with enhanced color mask registration, defect analysis and verification. KLA SP1 DLS has a broad range of inspection capacity, from single die analysis to large wafer inspection. It can detect very small defects with a 25nm resolution, and is able to characterize defects for wafer level defect analysis, defect clustering, extended defect analysis, and extended defect classification. The machine can also analyze an impressive range of substrate materials, including silicon, sapphire, quartz, GaN and a wide range of dielectric or conductive layers. Additionally, TENCOR SP 1-DLS is capable of evaluating numerous device structures, such as wire bonding, DRAM, SRAM, logic cells, MEMS devices and power components. In order to inspect productions with maximum efficiency, SP 1 DLS allows for multiple mask inspection configurations, which can be tailored to specific processes. Also, the tool is equipped with highly advanced software features that enhance efficiency, such as automatic defect extraction, die-by-die signature analysis and enhanced yield optimization tools. KLA SP 1 DLS's sophisticated array camera also helps to maximize the device's efficiency and accuracy. Its pixel resolution is three times higher than traditional inspection systems, allowing it to capture high-resolution images in both vertical and horizontal directions. It can detect up to 17 types of small defects that would otherwise be impossible to see. SP1 DLS is the ideal choice for semiconductor process inspection. Its advanced inspection technology, wide substrate material support, and unbeatable accuracy make it the perfect choice for any company looking for a reliable and efficient mask & wafer inspection asset.
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