Used KLA / TENCOR SP1-TBI SURFSCAN #9171668 for sale

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ID: 9171668
Wafer Size: 8"-12"
Vintage: 2004
Surface inspection system, 8"-12" -Haze sensitivity: 0.005 ppm -Argon ion laser (488nm) -RTDC (Real time defect classification) -Measurement chamber With ULPA filter and blower unit -Operator interface (Integrated measurement module) -OS: Microsoft Windows NT4.0 -Interactive pointing device Keypad controls -TFT Flat panel display -Parallel printer port -Defect map and histogram with zoom -Micro view measurement capability -Iomega 1GB removable jaz drive -(2) Clean room operations manual -SP1 Operations manual (softcopy) Illumination requirement: -Normal illumination - 0.083µm (Defect sensitivity and oblique) -Illumination: 0.060 µm Defect sensitivity -(4) Channels: Normal wide Normal narrow Oblique wide Oblique narrow -300/200-mm Puck-handling system -Single SMIF handling module Without FLUOROWARE cassette ID reader enclosures for 300/200 mm -Accessories: English and Japanese manual Operation training -Handling options: Single FIMS handler (1 × 300 mm) Vacuum handling system -Options: Bright field (DIC) X-Y Coordinate SECS-1 HSMS PC-NFS Client Desktop PC software Color printer (Hawlett Packard Business inkjet 2300 equivalent) Printer rack 2004 vintage.
KLA / TENCOR SP1-TBI SURFSCAN is a powerful mask and wafer inspection equipment which offers superior capability for defect detection and characterization. The system utilizes an advanced multi-axis scanning stage to provide extremely precise, three-dimensional imaging of defect locations and structures. The sophisticated dual detector array ensures all defect signals are accurately captured, while the multi-layer 3D reconstruction algorithms help the operator identify and classify defects more quickly. KLA SP1-TBI SURFSCAN also includes an advanced unit of defect classification tools. This allows the operator to search for specific types of defects, setting up individual "signature" selections tailored to the product characteristics. The inspection machine is also capable of performing a wide range of wafer level scans, with equipment settings and image analysis parameters tailored to each product type. The inspection tool is highly automated and can be programmed to work with manual intervention rates as low as 10%. This provides extremely high levels of output and throughput. The highly sensitive and advanced defect review capabilities of the asset reduce the need for sorting and reduce the overall semiconductor device manufacturing costs. TENCOR SP1-TBI SURFSCAN is designed to meet the highest standards for accuracy, reliability and repeatability. It is also robust enough to meet the extreme demands of high volume manufacturing. The advanced detection and classification capabilities of the model yield high throughput rates, while minimizing time spent on sorting processes. The mask and wafer inspection equipment includes a suite of high quality analytical tools which allow for advanced data analysis and reporting capabilities. The system provides direct access to the defect data and allows the operator to quickly identify and understand the type and severity of the defect. This analysis is further enhanced by the addition of time-stamping capabilities which allows for further analysis of specific types of defects and their root cause. SP1-TBI SURFSCAN is a true revolutionary in mask and wafer inspection. By putting powerful and reliable defect inspection within a compact unit, the performance levels of the machine exceed those of even the most advanced integrated defect analysis systems. KLA / TENCOR SP1-TBI SURFSCAN provides semiconductor manufacturers with a competitive edge by reducing the cost associated with mask and wafer manufacturing defects.
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