Used KLA / TENCOR SP1-TBI #9063330 for sale

KLA / TENCOR SP1-TBI is a mask and wafer inspection equipment developed by KLA Corporation that provides high-resolution, high-speed imaging of reticles, masks, and wafers. KLA SP1T-BI system is designed to enable high-quality, high-throughput inspection of optical lithography reticles, and it is capable of detecting very small defects on the sub-µm scale. TENCOR SP1 TBI unit consists of a Contac lens, an imager, and three image detectors. The Contac lens is an Imaging machine with a low-noise (30 dB) polarizing optical element with a powerful zoom range. It enables high-contrast imaging during wafer scanning and mask inspection. The imager is a CMOS detector that can scan up to a maximum of3 8K × 8K pixels in real-time with a 10 um/pixel resolution. The three image detectors are split- detectors, each with a different speed. The first detector has a higher speed with a two-microsecond readout time, while the other two have slower readouts of 12 and 20 microseconds. These detectors have increased sensitivity and better image quality when compared to imaging with a CCD. Moreover, SP 1 TBI tool has an integrated design with a streamlined inspection workflow. It features a fully automated optical asset for alignment and calibration, and multiple steps can be performed simultaneously, speeding up inspection times. Moreover, it provides three distinct inspection modes for maximum flexibility and improved accuracy. The first is an alignment mode for inspecting masks and reticles, which is done in a semi-transparent lighting mode. It has an accurate aligment algorithm to detect errors automatically. The second mode is for surface defects, which uses both bright-field and dark-field imaging techniques to identify small defects. The final mode is a penetration mode for inspecting shallow defects, which requires a CCD in addition to the other three detectors. Finally, KLA / TENCOR SP1T-BI model provides Wafer Inspection Modules (WIMs) to test wafers for microfabrication errors. The WIMs fully integrate into KLA / TENCOR SP 1-TBI equipment and can automatically detect, quantify, and monitor defects during the production process. Additionally, the system's advanced algorithms and high-contrast imaging ensure accurate inspection of optical reticles or mask data furnished by the Circuit Design Department or suppliers. TENCOR CorporationSP1-TBI unit is a powerful tool for mask and wafer inspection. It combines high-resolution imaging, enhanced defect detection capabilities, and streamlined workflow in a fully automated machine that is capable of quickly and accurately scanning reticles, masks, and wafers for defects. The tool's versatility, accuracy, and performance make it an invaluable tool for advanced manufacturing applications.