Used KLA / TENCOR SP1-TBI #9183811 for sale

KLA / TENCOR SP1-TBI mask and wafer inspection equipment is an advanced system used for the detection and accurate metrology of mask and wafer-level defects. It is designed to provide complete wafer-level and reticle-level inspection, as well as defect isolation and classification, with an unprecedented level of accuracy and speed. The unit combines an advanced reticle metrology stage with a state-of-the-art, high-resolution mask imaging machine. The reticle metrology stage is an active-scanning, air-bearing tool for a reticle inspection with simultaneous measurement capability. The asset measures physical dimensions such as critical reticle alignment and overlay, as well as more complex features such as critical defect sizes, size distributions, and defect shape features. The imaging model uses a patented quad-reflection equipment that produces four high-quality images of the reticle under inspection. These images are used to accurately detect and measure micro- and nanometer-scale defects on the reticle. The imaging system is designed to operate with a wide variety of substrate media, such as single crystals, polycrystalline, silicon-on-insulator, and thin films. In addition to high-resolution imaging and metrology, KLA SP1T-BI is also capable of identifying defects and generating detailed defect repair reports immediately, reducing the overall turnaround time. The unit integrates an automated defect inspection algorithm that provides a defect classification and analysis that includes size, shape, orientation, and type. TENCOR SP1 TBI is designed to be fully customizable and reconfigurable, allowing users to tailor the machine to specific requirements. The tool features a variety of tools, such as a part placement assistant, image analysis tools, and automated repair recommendations to facilitate defect identification and resolution. KLA SP 1 TBI mask and wafer inspection asset is a powerful tool for the accurate and precise detection of sub-micron features and defects on mask and wafer substrates. With its high-resolution imaging technology, automated defect analysis algorithms, and customizable tools, the model enables manufacturers to detect and quickly repair defects on mask and wafer substrates with unprecedented speed and accuracy.