Used KLA / TENCOR SP1-TBI #9293511 for sale

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ID: 9293511
Vintage: 2006
Surface inspection system Dual FOUP, 12" Type: Wafer handling vacuum Operating system: Windows NT 2006 vintage.
KLA / TENCOR SP1-TBI is a mask and wafer inspection equipment designed to deliver reliable and accurate defect detection for semiconductor fabrication processes. This system is based on the state-of-the-art TBI (Transient Beam Inspection) technology, allowing for diagnostic illumination that quickly reveals even the slightest issue. KLA SP1T-BI is a semi-automated inspection tool for precision semiconductor fabrication. It is designed to inspect logic and memory devices manufactured on state-of-the-art lithography fabrication equipment. It uses a series of lasers to pulse light at different wavelengths and angles, enabling high resolution imaging of sensitive features in a short period of time. This enables accurate detection of defects, from large ones to sub-micron details. The accuracy of the unit is further improved by its ControlScope technology, allowing operators to adjust parameters according to their desired performance. To assess defects, the machine is built with proprietary measurement algorithms and software tools such as Defect Review Editor and Defect Match. This helps identify the various types of defects and provides information on the size, shape, depth and position of the defect. TENCOR SP1 TBI is equipped with a highly sensitive calibrated and linear CCD detector matrix for accurate imaging and more accuracy. Its extended focus imaging technique neutralizes the effect of dust and out-of-focus defects, allowing for fast, accurate detection. The tool also offers robust CAD (Computer Aided Design) data support for a variety of data formats, allowing for quick setup and efficient process control. Furthermore, the asset can create reports with detailed information on faults and defects for comprehensive process analysis and traceability. All these features make SP 1 TBI an ideal solution for efficient mask and wafer inspection in semiconductor manufacturing. Its state-of-the-art TBI technology, robust CAD data support, control parameters and extended focus imaging technique provide fast, accurate detection of various types of defects, enabling consistent product quality and higher yields.
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