Used KLA / TENCOR SP2 #293603852 for sale

KLA / TENCOR SP2 is an advanced mask and wafer inspection equipment designed for the semiconductor industry. It is an ideal solution for high volume wafer level defects detection, and provides automatic optical inspection of front side and backside layer contact imaging. The system enables the detection of defects in semiconductor wafer manufacturing from the most complex pattern and contact shapes down to the very small details. KLA SP-2 has an advanced objective and illuminator that offers an apochromatic imaging unit for imaging a field of view with unequalled contrast, resolution, and spatial accuracy. Its unique dual spectrum imaging technique enables quick detection of both transparent and non-transparent defects down to 1um pitch. Additional imaging features include automatic non-uniformity correction, background subtraction, small feature resolution, and enhanced focus. TENCOR SP 2 operates in different wafer imaging modes, such as RGB photomicrography, brightfield imaging, and low light back side imaging. It has advanced inspection capabilities that can be used to inspect both etched and non-etched circuits, contact shapes, and defects in the substrate layer. Its intelligent inspection algorithms detect defects faster than manual wafer inspection by utilizing different types of filtering, convolution, and neural network clustering. SP 2 has a user-friendly graphical user interface (GUI), which allows operators to program the machine for more accurate defect detection and to check parameters used for processing. Additionally, the tool supports data analysis and management with a powerful suite of analysis and reporting tools. KLA / TENCOR SP-2 is designed to increase the yield rate of the manufacturing cycle and improve the process accuracy by providing fast and accurate defect detection. It is suitable for use in the wafer level wafer thinning process, bump and intermediate fine grain line formation process, and the handling of transparent technologies, such as 3D ICs, fingerprint authentication, and internet of things.