Used KLA / TENCOR SP2 #9282100 for sale

KLA / TENCOR SP2 is an advanced automated optical inspection (AOI) equipment designed for mask and wafer inspection applications. The system employs an advanced metrology and wafer inspection unit, combining high enforcement and repeatability with high resolution imaging. It offers enhanced defect detection capabilities and provides a wide range of coverage tools to meet process requirements and help reduce costs. KLA SP-2 machine includes advanced inspection and mapping technologies such as dark-field, multi-wavelength and polarised imaging, allowing it to inspect the most difficult defects in challenging devices. The tool also employs hybrid algorithms combining computer-aided detection and advanced microscopy for high accuracy defect detection and classification. Additionally, TENCOR SP 2 accelerates defect inspection and classification by using a true vector model-based defect capture and measurement algorithm, presenting a high-quality output that can be used as input to other specific analysis tools. KLA SP 2 asset further offers extended high resolution imaging capabilities with partial coverage and 3D imaging enabling customers to inspect nanometer-level defects on a variety of circuit layers and substrates. It also provides unique capabilities to classify and classify "floaters" (sub-micron particles), as well as localised edge and edge pull-in detection. SP2 model enables improved quality control by providing high sensitivity and low miss-rate capability. The equipment also enables high-throughput wafer inspection and quality control, increasing defect-per-hour ratings and enabling more efficient process operations. The system can be easily integrated into a company's existing unit process administration, and it comes with a comprehensive suite of application programming interfaces (APIs) for automation. KLA / TENCOR SP-2 machine enables accurate and repeatable mask and wafer inspection for reducing production costs and improving product quality. The reliable and robust tool, with its advanced image analysis capabilities, unrivaled metrology capabilities and intuitive user interface, together ensure the highest yield in device and wafer inspection.