Used KLA / TENCOR Surfscan SP1-TBI #293814743 for sale

ID: 293814743
Vintage: 1999
Wafer surface analysis system.
KLA / TENCOR Surfscan SP1-TBI is a mask and wafer inspection equipment designed to inspect the quality of semiconductor wafers and masks used in the fabrication of integrated circuit (IC) assemblies. The system uses proprietary, ultra-precise objectives, together with advanced optics and high-speed imaging technology, to detect small defects and impurities in critical layers of the wafer or mask material. KLA Surfscan SP1-TBI inspects wafers and masks quickly and accurately without the need for manual spot checks. The unit automatically scans the whole wafer or mask for defects and can isolate and measure individual features down to a minimum size of 0.5 micron. Surfscan avoids human errors associated with manual inspection procedures, reducing the cost of processing a wafer or mask from 2 hours to 10 minutes. The machine contains a precision robotic stage which attaches to the wafer directly, guiding it under the objectives for high-resolution inspection. The optics of the tool have a minimum resolution down to 0.5 microns and thereby detect defects not seen by other optical inspection systems. Additionally, the asset is equipped with an integrated particle counter which helps classify and classify defects into three categories based on quantitative measurements. TENCOR Surfscan SP1-TBI offers a number of additional features including an integrated darkroom, which allows the operator to view the wafer or mask under ultraviolet light; this helps to detect small scratches or particles not visible in the visible spectrum. The model also has a calibration module that enables the user to calibrate and align the optics perfectly before each inspection. Overall, Surfscan SP1-TBI is an advanced mask and wafer inspection equipment that is able to inspect wafers and masks at high speed. Utilizing extremely precise optics and sophisticated imaging technology, the system is able to detect small defects and impurities in the material layers, significantly reducing time-consuming manual checks and providing high-accuracy results.
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