Used KLA / TENCOR Surfscan SP2 XP #9221536 for sale

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ID: 9221536
Wafer Size: 12"
Vintage: 2006
Particle measurement system, 12" Sensitivity modes: Standard throughput inspection mode High throughput inspection mode High sensitivity inspection mode Advanced illumination optics supporting the following mode(s): Normal illumination Oblique illumination Includes: UV Laser Defect map and histogram with zoom iMicroView measurement capability SURFimage Real-time defect classification (RTDC) Microsoft Windows XP operating system Book on board Soft copy of operations manuals Puck handling: 8"/12" Equipped with powder coat painted panels 12" Phoenix dual FIMS vacuum wafer handler (PP) included Secondary UI for bulkhead installation Configured for MCCB (US/EU) power inlet Configured for IC/OEM Mfg surf quality recipe STD Throughput inspection mode High throughput inspect mode Optical filter Enhanced XY coordinates enabled: Standard classification LPD-N classification LPD-ES classification Grading and sorting 20° 40° Rough films Haze enabled Haze normalization enabled Haze analysis enabled Haze line classification enabled IDM SP2 2mm Edge exclusion 4 Color light tower (RYGB) GEM / SECS & HSMS T System (High speed messaging system) E87 Carrier management services (Based on E39) Based on E39 object services E40 Process job management E94 Control job management E90 Substrate Tracking (2) AdvanTag radio frequency (RF) carrier ID readers Identifies the name of the carrier (FOUP) Intended for use with phoenix handler and Isoport load ports One reader required for each FOUP load port 2006 vintage.
KLA / TENCOR Surfscan SP2 XP is an advanced wafer inspection equipment designed for high-precision, high-accuracy mask inspection and wafer surface characterization. It combines adaptive optics, low-noise imaging, automated measurement algorithms, and powerful computational capacity to offer a comprehensive platform for wafer characterization and defect analysis. KLA Surfscan SP2 XP features a large field of view (FOV) of up to 12mm and high optical resolution of better than 1µm, allowing it to accurately measure even sub-micron defects. It has the capacity to analyze up to 150 wafer images per minute and its automatic measurements combine tight spot detection, area scanning with data-driven filtering and pixel analysis. Its built-in image fusion technology gives the system the ability to accurately compare data from multiple sensors, ensuring the highest degree of precision. The unit is equipped with improved imaging software, an advanced image analysis library, and a powerful hardware design, allowing it to effectively detect contaminations, defects, and variations on wafer surfaces. It also includes a light source that can be adjusted to operate in either infrared, visible, or ultraviolet (UV) spectra, allowing it to inspect highly reflective surfaces as well as embedded features. The machine's multi-level defect detection and analysis capabilities enable it to not only detect particle contaminants but also to evaluate their composition, size, shape, and orientation. Furthermore, TENCOR Surfscan SP2 XP features an automated inline processing and reporting tool which provides real-time wafer defect information. Data analysis and reporting tools help users to quickly identify failure trends and take proactive measures in order to improve yield. With its advanced imaging, high resolution measurements, and robust hardware design, Surfscan SP2 XP is an ideal platform for mask inspection and wafer surface characterization. It is well suited for semiconductor production, packaging, and flat-panel display industries and provides a complete solution for high-throughput, high-precision wafer and mask inspection.
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