Used KLA / TENCOR Surfscan SP2 #9228176 for sale
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ID: 9228176
Vintage: 2006
Particle measurement system, 12"
P/N: 0074965-000
Sensitivity modes includes:
Standard throughput inspection mode
High throughput inspection mode
High sensitivity inspection mode
Advanced illumination optics supports following mode:
Normal illumination
Oblique illumination
Enables qualification of current and next-generation substrates:
SOI
Strained SOI
Strained SI
Optimized sensitivity
Throughput: - < 37nm defect sensitivity on polished bare silicon
Qualification and monitoring of process tools: 90, 65, & 45 nm technology nodes
Components included:
UV Laser
Defect map and histogram with zoom
Micro view measurement capability
Surf image
Real-time defect classification (RTDC)
Operating system: Microsoft Windows XP
Book on board
Operations manuals
Puck handling: 300/200mm
Equipped with powder coat painted panels
Phoenix dual FIMS vacuum wafer handler, 12" (pp)
Secondary UI for bulkhead installation
Configured for MCCB (us/eu) power inlet
Configured for IC/OEM mfg surf quality recipe
Optical filter
Enhanced XY coordinates:
Standard classification
LPD-N classification
LPD-ES classification
Grading and sorting
20 Degree
40 Degree
Rough films
Enabled:
Haze
Haze normalization
Haze analysis
Haze line classification
IDM SP2
Edge exclusion: 2mm
4 Color light tower (RYGB)
Gem/secs and HSMS
E39 Object services:
E40 Process job management
E94 Control job management
E90 Substrate tracking
E87 Carrier management services (based on e39)
Control jobs (E94 Based on E39)
Substrate tracking (E90 Based on E39)
(2) Advantage radio frequency (RF) carrier ID readers:
Identifies name of carrier (FOUP)
Intended for use with phoenix handler and isoport loadports
Reader required for each FOUP loadport
2006 vintage.
KLA / TENCOR Surfscan SP2 is a mask & wafer inspection equipment designed for the semiconductor fabrication industry. This system allows for the inspection of image quality, pattern fidelity, and in-depth defect inspection for the production of integrated circuits and other microelectronic devices. It offers unparalleled imaging speed and resolution to help ensure that the highest quality mask and wafer images are produced. KLA Surfscan SP2 is powered by a set of advanced optics and high-end detectors coupled with a high-powered computer unit for fast processing. It utilizes Laser Interferometric Confocal Technology (LCT) to capture and analyze sub-pixel sized defects. The machine also utilizes patented 3D scan lenses and high-definition image detectors to increase the accuracy of the inspections. TENCOR SURFSCAN SP 2 is equipped with a set of calibration standards for a variety of wafer materials such as Al2O3, InP, SiGe, etc. This helps ensure that the best imaging results are achieved during the inspection. The tool can also detect a variety of abnormal 3D patterns on the masks or wafers, allowing for improved detection of subtle defects and variations. KLA / TENCOR SURFSCAN SP 2 is designed to provide a comprehensive mask and wafer inspection solution. This includes the ability to inspect Moire patterns, fiducials, CD patterns, and micro-patterns down to 0.12 microns. All of these features can be inspected in real-time, removing the need for post-inspection analysis. Additionally, the asset can detect oxide and particle defects, thinning or thickening, and other sub-micron film defects. For further analysis, TENCOR Surfscan SP2 is equipped with a large number of image functions, including magnifying glass, area select, zoom, guide line superimposition, and profile measurement. It also includes a range of filters, such as color inversion, timestamp, focus level, and edge detection. Each of these functions is designed to improve the accuracy and speed of the inspection process. Overall, Surfscan SP2 is a powerful and reliable mask and wafer inspection model for semiconductor fabrication. It offers industry-leading speed and resolution for a wide range of image analysis and inspection tasks, making it a great choice for quality control and production optimization.
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