Used KLA / TENCOR TeraScan 586 #9025479 for sale

ID: 9025479
Vintage: 2003
Die-to-die reticle inspection system Single 125 transmitted light pixel S10 die to die scan speed configuration COG test reticle EPSM test reticle Upgrades: TeraPhase 501 Die to Die altPSM Capability. Includes: Single 125P transmitted light pixel; AltPSM test reticle TeraFlux 505 Die to Die Flux Defect Capability. Includes: Concurrent operation with standard die to die mode; EPSM contact test reticle SMIF RSP200 Integrated Loader 2003 vintage.
KLA / TENCOR TeraScan 586 is an automated mask and wafer inspection equipment designed to swiftly detect and characterize anomalies such as contaminants, particulates, and crystal lattice defects. This system provides superior spatial resolution and sensitivity which enables better risk assessment and defect characterization than other tools. KLA TeraScan 586 is a high-resolution sensor that facilitates 3D topographical imaging, enabling operators to detect small defects with up to 1000x higher sensitivity than typical scanning electron microscopes or optical microscopes. The high-resolution sensor yields defect images that can be analyzed and quantified with ease. TENCOR TeraScan 586 is equipped with a die to wafer edge detector, which enables it to precisely measure dimensions, flatness and height of the wafer in real time. The unique ability of the instrument to detect and characterize surface (epi) and sub-surface (SPM/AFM) defects ensures complete wafer coverage. The unit comes with an intuitive and user-friendly touch screen interface that enables operators to quickly inspect both the front and back side of wafers, or masks. The QuickMap capability of TeraScan 586 quickly performs comprehensive process characterization and verifies pattern fidelity over a large field of view for rapid evaluation of the 1000x magnification range. Moreover, the machine includes an AFM module with graphical tools to analyze and display data. This feature enables operators to more easily identify and characterize surface defects such as isolated pits, scratches, and nanoparticles. Additionally, KLA / TENCOR TeraScan 586 automatically detects border misalignment and aberration caused by thermo-mechanical stress or process variations. KLA TeraScan 586 includes adjustable environmental conditions and state-of-the-art optics to ensure accurate measurements no matter the application. Furthermore, it comes with a software-driven autofocus stage that listens and responds to any irregularities found during inspection, resulting in improved quality control and faster throughput. The tool delivers rapid, high-resolution measurements and inspection with industry-leading precision, enabling faster time to market and cost savings. With superior instrumentation, TENCOR TeraScan 586 is an accurate and reliable inspection asset capable of detecting a wide range of defects suitable for both masks and wafers.
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