Used KLA / TENCOR WI-2280 #9382888 for sale
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KLA / TENCOR WI-2280 Mask and Wafer Inspection Equipment is a comprehensive machine that provides a complete bond and static inspection solution for non-conductive test substrates. It uses a unique optical system to identify defects, including conducting particles, shorts, opens and substrate defects. KLA WI-2280 also offers high resolution images from a variety of angles and magnifications. TENCOR WI-2280 utilizes an advanced optical unit that provides inspection of the entire test substrate, producing high-contrast images from all angles and magnifications. The imaging optics capture a clear and crisp image of the test substrate in full color, with a magnification range of up to 1000x. The optics also allow for both top and secondary surface imaging of the test substrate, enabling the machine to identify defects down to 0.35µm wide. WI-2280 also features an automated image capture and processing tool designed to enhance the speed and accuracy of defect analysis. It is capable of taking up to 1,500 images per second, with image processing that can improve the measurement accuracy and reduce testing time. In addition, the automated image analysis software allows users to customize the sensitivity of the image analysis and to quickly identify the presence and pixel area of defects. KLA / TENCOR WI-2280 also incorporates an autonomous defect sorting asset, which automatically ranks detected defects for quick pass/fail results. This allows users to quickly determine if a sample passes the test or requires further analysis. Additionally, the model offers flexible matching capabilities with its integrated OCAP software, enabling users to adjust matching parameters according to their specific requirements. Overall, KLA WI-2280 is a comprehensive machine that provides a complete bond and static inspection solution for non-conductive test substrates. It utilizes a powerful optical equipment, automated image capture and processing system, and autonomous defect sorting unit to quickly and accurately identify and classify defects down to 0.35µm wide. The flexible matching capabilities of the OCAP software further enhance the accuracy and speed of the machine, enabling users to efficiently perform both pass/fail inspections and detailed analysis.
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