Used KOSAKA LAB RSP300-11 #293637186 for sale

KOSAKA LAB RSP300-11 is a mask & wafer inspection equipment designed to detect defects in the pattern formation process of photolithography and the layout of design data. It offers inspection solutions for a wide range of processes including FEOL (front-end-of-line), BEOL (back-end-of-line) and WLP (wafer-level packaging). The system consists of four main components: a photolithographic projection unit, a power supply, a video camera, and a computer. The photolithographic projection machine is comprised of a multi-beam laser and a movable, X-Y-Z stage. It is used to project the lithographic reticle onto the wafer and to inspect the resist layer pattern formed on the wafer surface. The power supply supplies power to the laser and stage controls. The video camera is a high-resolution digital camera that takes images of the wafer. The computer tool is used to control and analyze the data generated by the asset. RSP300-11 uses an advanced algorithm to inspect and analyze the pattern formed on the wafer. It is capable of detecting process-related defects that are not detectable by visual inspection. It can also detect gross defects due to pattern misalignment related to photomask misalignment and line width step-down errors. The model can be easily configured with various inspection options such as Shower File, Chor File, Laser Scanning, Sectors, etc. for more targeted defects detection. The equipment also includes a suite of automatic tool functions such as defect summary, defect region mapping, repeat failure analysis and statistical defect analysis. KOSAKA LAB RSP300-11 is capable of storing previous data and using it for results comparison and comparison against customer specifications. The system also provides a feature whereby false relative signals due to background noise of the pattern can be removed by controlling their intensities. In summary, RSP300-11 is a high-performance mask- & wafer inspection unit that offers advanced features to detect pattern defects and compare against customer specifications with minimal user effort. Its advanced algorithm, multiple configuration options and automatic tool functions allow users to quickly and efficiently detect process-related defects and improve process window stability and product yield.