Used LEICA INS 3300 #9195040 for sale

LEICA INS 3300
ID: 9195040
Wafer Size: 12"
Wafer inspection microscope, 12" (2) Load ports Resolution: 150x Inspection and review: Front access module with visual inspection (Eyepieces) MPS Modification asia (230V) Carrier ID hermos (SECS/FFO) fixload INS 3300 Basic system front access with VIP (2) Fixload 25 rev. 6M BROOKS (2) Heimos RF (SECS FFO) fixload 6M WID Reader SIEMENS LKx5 - front side UV Option: INS 3300 DUV Option high performance INS 3300 DIC Option (2) E84-Interface AGV fixload 6M OHT - Interface (E84-compliant) GEM300 CIM Fab automation interface (2) BROOKS Fixmap for fixload V6M Programmed inspection Renew interface DUV-ADC Option UV-ADC Option Auto alignment ADC NT KB Wizard stand alone Multifocus image generation INS 3300 MPS Modification asia 230V Objective: 5x, 10x, 50x, 100x, 150x UV PC.
LEICA INS 3300 is an advanced mask and wafer inspection equipment designed to facilitate rapid and precise inspection of semiconductor masks and wafers. It offers an advanced imaging system which takes advantage of several techniques, such as brightfield imaging, darkfield imaging, quadrant imaging, as well as UV or IR imaging, to provide optimum performance. The advanced imaging unit of LEICA INS3300 supports up to 10 megapixel resolution, making it possible to inspect high-resolution images of masks and wafers. This allows users to capture sharp images of microscopic features on a mask or wafer, with unprecedented detail. The advanced optics used in this machine allows the user to work with higher magnifications, up to 27x, or even split-beam imaging which allow for even higher resolutions. INS 3300 also includes a 200mm wafer stage that serves to accommodate different wafer sizes and can also accommodate asymmetric pieces and is compatible with standard stepper and reticle stages. This helps to ensure fast and accurate wafer and mask inspections. INS3300 also includes a powerful computing cluster, which allows it to process numerous images at high speeds. It also contains a host of software tools for analysis and post-processing, such as defect analysis and reporting, de-speckling, spectral analysis, and post-process defect mapping. This enables users to quickly identify and rectify defects in masks and wafers with great precision. Finally, the tool features a range of sophistication accessories, such as a map plotting tool, a semi-automated microscopy script generator, a short focus option, and an auto-calibration option. As well as instruments dedicated to controlling humidity and temperature to meet the requirements of semiconductor industry. All of these features make LEICA INS 3300 an advanced and reliable instrument for mask and wafer inspection.
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