Used LEICA / VISTEC INS 3300 #9043662 for sale

LEICA / VISTEC INS 3300 is a versatile mask and wafer inspection equipment designed for top-down or bottom-up inspection. It offers maximum flexibility with modularity and scalability, enabling users to start with a basic configuration and add advanced options over time to suit their changing needs. The system is capable of a wide array of inspections, with a maximum resolution of 0.25µm over its full exposure range of 0.8 - 6.5keV. Features such as Depth of Focus Control (DoFC) and 90° auto-stitching make it ideal for inspecting samples with uneven topographies or challenging surfaces. LEICA INS 3300 is equipped with a versatile stage, which holds up to two 200mm or one 300mm wafers and provides automatic alignment for multi-chip mapping as well as the ability to inspect the same wafer twice. It can also accommodate a variety of mask sizes with a movable mask table that can be adjusted to hold both positive and negative polarity masks. High-end automation functions and defect review capabilities provide users with a powerful and efficient tool to identifying and classify defects. In addition, the unit offers a versatile and advanced machine for measuring electrical and optical properties of patterns or substrates. This includes automated electrical measurement systems, such as the Digital Pattern Analysis (DPA) and Digital Image Scanner (DIS), which enable users to quickly capture and analyze electrical images. These systems can also be used for optoelectronic measurements, by combining with the multi-wavelength photomask aligner. Overall, VISTEC INS 3300 is a powerful, versatile, and easy-to-use mask and wafer inspection tool. It is capable of a variety of inspections, and can be readily adapted to accommodate changing needs. It is ideal for laboratories looking for a robust yet cost-effective asset, allowing for quick and accurate analysis of the most intricate patterns and substrates.