Used LEICA / VISTEC INS 3300 #9174843 for sale

LEICA / VISTEC INS 3300 is a highly advanced mask and wafer inspection equipment. It uses an automatic wafer inspection and achromatic dimensional measurement to identify and correct any imperfections in the mask or wafer. The system's three-dimensional imaging capabilities provide high resolution topographical images of the current structure of the mask or wafer. The unit is designed for automated operation and is equipped with a unique auto alignment feature to ensure consistent imaging results. The machine is also equipped with a variety of algorithms to automatically analyze the data and detect any defects. These algorithms are designed to detect particle defects, surface irregularities, pattern defects, and scaling issues. The tool supports both manual input of wafers to the asset, and automated loading using a robotic wafer handler. The automatic loader is capable of placing up to 50 wafers at one time. The machine is designed to run continuously for large production runs. Additionally, the model is equipped with a statistical process control (SPC) package for tracking performance and results. This SPC package provides real-time data that enables users to see trends and identify possible problems before they negatively affect the production. All of this data is accessible via a user-friendly GUI. Using LEICA INS 3300, users have the ability to accurately measure critical dimensions both on-wafer and across the entire substrate. The equipment is accurate to sub-micron levels and the data collected is typically used for process control and characterization. VISTEC INS 3300 is a highly advanced inspection system. It offers an automated operation with a unique auto alignment feature, provides high resolution topographical images of the structure of the mask or wafer, and has a variety of algorithms to automatically detect any defects. Additionally, it is equipped with a statistical process control package for tracking performance and results, as well as the ability to measure critical dimensions both on-wafer and across the entire substrate. In short, INS 3300 offers complete, accurate, and efficient mask and wafer inspection.