Used LEICA / VISTEC INS 3300 #9192641 for sale

LEICA / VISTEC INS 3300 is a high-precision and automated mask and wafer inspection equipment designed for semiconductor research and manufacturing. It is capable of working with mask sizes ranging from 8 inches (20.5 cm) to 12 inches (30.5 cm), offering both optical and X-ray inspection. The optical inspection uses a highly sensitive scientific-grade CCD camera and interchangeable lens system, automatically detecting defects such as scratches and site-specific defects. LEICA unit focuses on the highest levels of accuracy, using both dynamic video auto measurement (DVAM) technology and advanced computer software to ensure the accuracy of detection and measurement. For X-ray inspection, LEICA INS 3300 features a state-of-the-art micro-focus X-ray source and a variable spot size to allow for defect-specific imaging. In addition, the machine is able to detect interlayer defects and burial defects from silicon wafers, making it ideal for advanced processes. Other features that make it a top-of-the-line inspection tool include a full-HD LCD monitor, touch screen control panel, and advanced wafer-handling asset. The high-end inspection model also features an automatic alignment correction tip set for alignment of multiple patterns. Data can be transferred quickly via USB and software interface, and data can also be downloaded onto a computer for further analysis. Finally, VISTEC INS 3300's customizable user interfaces, self-diagnostic programs and automatic alerts make it a user-friendly equipment that simplifies the inspection process. With its reliable performance, comprehensive defect detection, and high-precision accuracy, INS 3300 is an effective and cost-efficient mask and wafer inspection system for semiconductor industry applications.