Used LEICA / VISTEC LDS 3000M #9267069 for sale

LEICA / VISTEC LDS 3000M is a mask and wafer inspection equipment designed to detect and identify defects in intricate geometrical structures. The system features an ultra-high resolution 5.3 megapixel (MP) color line-scan camera that features a large field-of-view with multiple frames per second. Images can be displayed in color on a 17-inch monitor allowing easy assessment and comparison of multiple samples. LEICA LDS 3000M utilizes high-end optics and an advanced imaging unit to produce a consistently high quality and stable image. A precision stage motion machine is integrated into VISTEC LDS 3000M to enable both high-speed scanning and high-precision mask alignment. The tool's advanced optical asset can detect features down to 40nm in size. LDS 3000M can also detect light intensity variations up to 20dB. LEICA / VISTEC LDS 3000M is able to detect very small defects, such as pinholes and nodules, even in devices with large areas. Furthermore, the model has an enhanced inspection capabilities that can quickly detect particular failed sites, such as misalignment, spacing, and line-widths. LEICA LDS 3000M also offers advanced defect classification capabilities that help to identify patterns within individual masks with a high degree of accuracy. VISTEC LDS 3000M is capable of rendering a complex image in the blink of an eye, enabling faster and more accurate assessments. The equipment provides automated defect categorization, which reduces inspection time significantly. LDS 3000M also offers the ability to further refine defect extraction for more precision. LEICA / VISTEC LDS 3000M comes equipped with a range of editing and analysis functions that offer a powerful environment for examining and analyzing masks. The images produced by LEICA LDS 3000M can be saved in image format or exported in various file formats, allowing for further analysis. Overall, VISTEC LDS 3000M is an advanced and highly automated high-resolution mask and wafer inspection system capable of swift and accurate defect detection. It's advanced imaging unit is designed to produce an ultra-high resolution and stable image of mask and wafer defects, while its automated defect categorization ensures efficient and accurate results.