Used LEICA / VISTEC LDS 3300C #9249375 for sale

LEICA / VISTEC LDS 3300C is a high-end mask and wafer inspection equipment developed by LEICA. It is designed to detect and locate patterns on masks or wafers and provide information about features such as pitch, overlay, and defect sizes. LEICA LDS 3300C is a comprehensive system capable of detecting a wide range of defects including particle defects, etching faults, registration errors, and surface variations. VISTEC LDS3300C consists of three components: the Control Unit, Vision Unit, and the Wafer Handler. The Control Unit contains the central processing, controlling, and analyzing software applications. The Vision Unit contains dual objective lenses for imaging, as well as hardware components that send inspection signals to the control unit to be processed. The Wafer Handler is responsible for mounting the wafer and moving it into position for inspection. LDS3300C also features two types of wafer inspection, Unidirectional Inspection (UDI) and Circular Scanning (CS). UDI is used to inspect full-field masking and registration on the wafer's surface. CS is used for high-speed wafer inspection, scanning portions of the wafer along the circumference of the wafer. For both UDI and CS, LDS 3300C detects defects that are much smaller than the pitch size. It can also distinguish defects that are difficult to detect such as misregistration of aperture edges and isolated defects. VISTEC LDS 3300C utilizes VISTEC fast and reliable algorithms for image processing and evaluation, providing users with high-speed performance. The unit is also capable of multi-site wafer scanning, and can easily be integrated with other or customized software applications. Overall, LEICA / VISTEC LDS3300C is an advanced mask and wafer inspection machine with features that provide unmatched accuracy, reliability, and speed. Users of LEICA LDS3300C can ensure high-quality surface structures in their mask and wafer through its powerful yet user-friendly interface.