Used LEICA / VISTEC LDS 3300C #9285848 for sale

LEICA / VISTEC LDS 3300C
ID: 9285848
Wafer Size: 12"
Automated defect inspection system, 12".
LEICA / VISTEC LDS 3300C is a mask and wafer inspection equipment designed for use in semiconductor and microelectronics manufacturing processes. Utilizing state-of-the-art 3D imaging and automated defect detection algorithms, LEICA LDS 3300C can quickly and accurately detect defects on masks and wafers at the molecular level. VISTEC LDS3300C can measure within one nanometer and detect defects as small as 0.06 µm. In addition to defect detection, the system is capable of making accurate measurements of the critical dimensions of masks and wafers, as well as of the resistance of materials to electrical currents. LDS 3300C is equipped with a special high-resolution camera capable of capturing images of masks and wafers at magnification levels up to 500,000 times. By combining the camera with image-processing software and powerful 3D imaging algorithms, the unit is capable of accurately detecting even the smallest defects. It is also capable of measuring small areas, such as contact pads, and can make 3D surface measurements with a high degree of accuracy. The machine is designed to be easy to operate and maintain. It features an intuitive user interface, customizable settings, and a menu-driven operation tool. LEICA / VISTEC LDS3300C is also equipped with an automated calibration asset, which ensures that the model continues to operate accurately and properly, regardless of the conditions or environment. LEICA LDS3300C is an excellent choice for any mask and wafer inspection requirements. It is highly accurate, reliable, and easy to use. It is a powerful tool for the production and testing of integrated circuits, providing greater accuracy and quality assurance than ever before.
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