Used LEICA / VISTEC LDS 3300M #293652321 for sale

LEICA / VISTEC LDS 3300M is a fully automated mask and wafer inspection equipment designed for high-precision analysis of photomasks and wafers composed of fine line and high-contrast features. This system incorporates a high resolution 1000 μm inspected area camera, allowing for up to a 140 MP resolution, enabling high-resolution imaging of surface and sub-surface features. It supports a wide array of both reflective and transmission mask materials and enables imaging of features down to 20 nm line and space. LEICA LDS3300M is equipped with a number of powerful post-processing tools, such as image subtraction, image adding, comparison and mask alignment. The aligned images can then be further processed with features including color coding, 3D inspection, and false color mapping. VISTEC LDS 3300 M is equipped with sophisticated optics and image processing capabilities to ensure reliable, accurate and speedy inspection. Its unique high-precision inspection technology is specifically designed for the evaluation of alignment accuracy, i.e. dimensional accuracy between mask and wafer. This unit is ideal for mask qualification, development supervision of product designs, and parameter verification and confirmation. In addition to its precision, the machine can be programmed to execute several inspection tasks in parallel, allowing for improved process and product data throughput. LDS 3300 M contains an advanced brightness and contrast control tool that allows for the user to modify brightness and contrast settings for both bright-field and dark-field imaging and for distinguishing image noise from image defects. Furthermore, the asset contains an integrated automated defect review and classification process, allowing for the enhancement of productivity during inspection and review. LDS3300M also includes a set of built-in chip qualification modules to ensure reliable chip production process, as well as a variety of built-in performance metrics that allow for the easy qualitative and quantitative evaluation of mask performances. Finally, the preventative maintenance model included in LEICA / VISTEC LDS 3300 M ensures that the equipment consistently operates at peak efficiency. The system allows for remote error detection and notification, making it ideal for high-throughput and critical manufacturing environments. LEICA LDS 3300M provides a fast, accurate and reliable solution to mask and wafer inspection and is one of the most advanced mask and wafer inspection systems available today.