Used LEICA / VISTEC LDS 3300M #9394051 for sale

LEICA / VISTEC LDS 3300M is a comprehensive mask and wafer inspection equipment offering automated scanning of photomasks and lithography wafers. The system is quick and effective in detecting defects on a variety of production substrates. It is capable of inspecting wafers up to 12 inches in diameter with a variety of imaging modes, including brightfield, darkfield, transmission, and scatter. LEICA LDS3300M employs a digital signal processor and laser diode to quickly compare the reflected pattern from the mask or wafer against a high-resolution reference image. It is a highly versatile unit capable of quality inspection and defect detection in a variety of production steps. The machine can automatically scan up to 50 wafers per hour and identifies any mismatch in the pattern images. The tool includes an intuitive software interface, making it easy to customize inspection parameters and settings. VISTEC LDS 3300 M supports multiple configuration options, allowing users to fine-tune detectors, size parameters, and other settings. It also supports a wide range of alignment methods, enabling efficient automated scanning. Additionally, LDS 3300M comes equipped with a powerful analysis engine. This engine can detect and classify various types of defects, including edge irregularities, interferences, broken patterns, and others. This data can then be used to generate comprehensive reports for evaluation and implementation of corrective measures. The asset also records detailed display information such as size, type, and location of defects, enabling users to visualize and quantify their inspection results. LEICA / VISTEC LDS3300M is an excellent choice for the inspection of photomasks and lithography wafers. It is reliable, accurate, and user-friendly, making it a well-suited choice for any production setting. The model is well-equipped to handle a variety of inspection tasks, ensuring that the final product is free of any potentially damaging defects.