Used LEICA / VISTEC MIS 200 #9262659 for sale
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ID: 9262659
Wafer Size: 8"
Vintage: 1995
Inspection system, 8"
Broken air dumper
1995 vintage.
LEICA / VISTEC MIS 200 Mask and Wafer Inspection Equipment is an advanced technology that combines optical imaging systems and advanced 3D imaging algorithms to provide a comprehensive solution for inspecting integrated circuit (IC) substrates and masks during IC fabrication. The system enables a wide range of high-resolution inspection operations, including optical inspection of IC test vehicles, assembly of masks, and electrical verification. The modular unit is highly versatile and can be fully customized to meet any production requirements. LEICA MIS 200 machine features an efficient design with a small footprint and low installation costs. The tool is equipped with a powerful computer processor and high-speed memory. The computer asset is connected to a digital signal processor (DSP) for improved performance. It also features hot-swappable hard drives for easy data storage and retrieval. There are both an optical microscope and a wide-field microscope for detailed inspection of IC test vehicles and masks. The model is equipped with a range of 3D imaging algorithms for inspecting integrated circuits. These algorithms can analyze the topography of ICs, detect defects such as open circuits, shorts, and bridging, and provide accurate visual representations of the ICs. This helps to ensure reliability, accuracy, and regulatory compliance. The algorithms also help to detect and classify defects quickly and accurately. VISTEC MIS 200 also includes an array of advanced metrics and diagnostics tools. These powerful metrics analyze and display the results of different measurements, enabling technicians to identify any significant issues with the circuit or the mask. The equipment is compatible with industry-standard protocols and devices, enabling connection to automated test equipment, optical systems, and other hardware. MIS 200 Mask and Wafer Inspection System is an ideal solution for any IC fabrication application. Its advanced imaging algorithms help to maintain a high level of accuracy and reliability for any ICs, and its customized configuration and powerful tools allow technicians to quickly and easily diagnose any potential defects.
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