Used LEITZ MM6 #9150088 for sale

Manufacturer
LEITZ
Model
MM6
ID: 9150088
Wide field metallographic microscope pancratic optical system Manual X-Y Stage with large rotary stage 450W XBO Xenon light source Large view screen, automatic large 4X5 format camera (1) Periplan GW 8x M eyepiece (1) Periplan GW 8x M F eyepiece Dust cover Objectives: PL 80x/0.95 Achromat Plano Objective PL 160x/0.95 Achromat Plano Objective PL 3.2x/0.06 Achromat Plano Objective PL 8x/0.18 Achromat Plano Objective PL 16x/0.30 D Achromat Plano Objective PL 32x/0.50 D Achromat Plano Objective.
LEITZ MM6 Mask & Wafer Inspection equipment is an automated wafer defect patch inspection system that offers high-speed and in-depth inspection of various types of defects on a variety of wafer sizes. The unit uses pattern recognition technology to detect design and process-related defects. It provides highly accurate, fast and reliable defect detection and classification. The machine offers comprehensive integration of hardware and software modules that work together to provide an automated solution for comprehensive wafer defect detection and correction. It includes various subsystems such as a mask inspection subsystem, a pattern recognition subsystem, a defect classification subsystem, a defect localization subsystem, and a mask data archiving subsystem. The Mask Inspection Subsystem allows the user to choose from a variety of scan modes for an optimum patch selection and defect confirmation. It utilizes line scan technologies to achieve superior accuracy. The scan modes include single scan, multiple scan, contrast scan, segment scan, and reverse scan. The Pattern Recognition Subsystem uses a variety of methods such as optical and physical pattern recognition, silicon-on-insulator (SOI) fitting algorithms, and state-of-the-art template matching algorithms to identify defects. It is capable of identifying a wide range of defects including roughness, contamination, edge roughness, and others. The Defect Classification Subsystem is an advanced technology that assigns each defect a classification number. This enables the user to quickly and accurately identify the type and size of the defect. The classification code includes a number indicating the severity of the defect. The Defect Localization Subsystem is used to accurately identify and monitor defect locations. The tool is capable of detecting extremely small defects at a high resolution. The Mask Data Archiving Subsystem allows users to store mask data for future reference. It is capable of archiving up to 10,000 mask patterns. MM6 Mask & Wafer Inspection Asset is a powerful tool that helps ensure the accuracy and efficiency of wafer inspection and defect correction. It provides a comprehensive and automated solution for efficient defect patch inspection and correction. The model provides reliable and high-speed operations and offers superior results.
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