Used MEISHO MS-8000N #9123176 for sale

ID: 9123176
Vintage: 2014
Rework machine Does not included: nozzle, camera 2014 vintage.
MEISHO MS-8000N is a state-of-the-art mask & wafer inspection equipment designed to provide the precise, reliable and accurate inspection results needed for the rapid development and production of advanced microelectronic components. The system is comprised of an advanced vision unit featuring an inspection camera, a multi-sensor line scan machine, a laser micro-spot alignment tool, and a full suite of image processing and analysis algorithms. The asset's inspection camera is a high-precision machine-vision device capable of capturing up to 1920×1080 resolution images with exacting accuracy. The multi-sensor line scan model utilizes advanced imaging technology to capture defect information across the full length of each wafer or mask. The laser micro-spot alignment equipment is used for precise placement of inspection nodes, while the sophisticated image processing algorithms analyze and identify defects and irregularities in real-time. MS-8000N also offers a range of 2D and 3D inspection capabilities. The 2D inspection module integrates advanced image analysis algorithms for inspecting the integrity of features on the mask or wafer surface. The 3D inspection module provides a detailed analysis of each feature on the surface and can be used to detect surface irregularities such as pitting, shrinkage, and aberrations. The system also features a sophisticated alert unit to alert users to anomalies in the inspection results and provide them with immediate feedback. The machine is highly user-friendly, as it can be operated from anywhere in the world via an internet connection. It includes both software and hardware components to ensure reliable operation. MEISHO MS-8000N is the perfect partner for research and development of advanced microelectronics. With its cutting-edge technology and comprehensive functionality, the tool is capable of identifying and detecting defects more quickly and accurately than ever before, leading to improved production efficiencies and greater product integrity.
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