Used NANOMETRICS NanoSpec 210 XP/UV #9105590 for sale

NANOMETRICS NanoSpec 210 XP/UV
ID: 9105590
Film thickness measurement system.
NANOMETRICS NanoSpec 210 XP/UV is a mask and wafer inspection equipment that combines automatic alignment with high resolution imaging and user friendly software that makes it fast and easy to operate. The system has been designed for use in a variety of wafer and mask inspection applications, providing excellent optical performance and flexibility for a wide range of analysis requirements. The unit features a large, high resolution optical microscope for inspection of wafers, masks, and chips. The microscope has a FOV of 75 mm and an adjustable magnification up to 200x. The optics are designed to deliver excellent image clarity with low aberrations, which improves measurement accuracy. The microscope also features a 5 megapixel CMOS imaging sensor with 14-bit Dynamic Range and excellent color sensitivity. NANOMETRICS NanoSpec 210 XP/UV also offers an advanced stage scanning machine for the fastest and most accurate imaging. The tool features a high speed scanning asset with an indexer, designed for precise and simultaneous movement on all three axes (X, Y and Z). The indexer motor is designed for fast movement with minimal vibration: it can move up to 40 mm in as little as 40 ms, providing a scanning speed of over 200mm/s. The NanoSpec 210 XP/UV also includes an automatic alignment model to ensure that the wafer or mask is accurately positioned and aligned to the corresponding pattern on the monitor. This ensures consistent performance, even when taking multiple images at different angles and locations. The equipment also has a data recording capability, allowing the user to store images and detailed measurements to their computer for further analysis and reporting. To enable the user to quickly and accurately measure the design patterns on a wafer or mask, the system includes a built-in Optical Proximity Measurement (OPM) unit for precision analysis. The OPM machine can measure up to 100 features with accurate positioning and size determination. The OPM tool also includes an advanced pattern recognition algorithm for optimal performance. Finally, the user friendly software interface makes it easy to control the asset and perform complex operations. The software includes a comprehensive set of settings and options to customize the analysis, allowing the user to quickly and accurately measure design patterns, defects, and more. Overall, NANOMETRICS NanoSpec 210 XP/UV is an advanced mask and wafer inspection model. With its high resolution imaging, fast scanning stage, and accurate data recording, the equipment offers excellent performance and flexibility for a variety of wafer and mask inspection applications.
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