Used NANOMETRICS NanoSpec 2100 #9272568 for sale

NANOMETRICS NanoSpec 2100 is a next-generation mask and wafer inspection equipment that enables the analysis and production optimization of optical photomasks and ICs. The system utilizes advanced optical imaging technologies and 3D mapping to capture and analyze defect images with unparalleled accuracy and fidelity, allowing for complete and accurate visibility into the manufacturing process. NanoSpec 2100 offers true three-dimensional defect evaluation and advanced optical measurement capabilities, delivering faster, more precise information that accelerates the development and production of integrated circuit devices and masks. The unit measures feature-level defects up to 0.005 μm in size and features an adjustment-free statistical metrology algorithm for the automated detection and characterisation of wafer defects. NANOMETRICS NanoSpec 2100 is ideal for detailed defect analysis and review, providing automated recognition and accurate sizing of defects, voids, and pits. The machine's advanced hardware and software inspections provide comprehensive results for wafer and mask defect inspection, allowing for detailed evaluation of masking and compositional deviations across multiple levels and sites. Wafer measurements can be carried out in both single defect and multiple defect modes, with defect listing, sorting, and analysis capabilities providing an efficient way of addressing failure mechanisms and areas. The tool's software interface supports operator training and allows users to customize the inspection process and define criteria to focus on the areas of greatest interest. NanoSpec 2100 asset also allows for the transfer of defect images and data to other database systems, making it ideal for data sharing, analysis, parameter setting, and retrieval within the manufacturing process. Overall, NANOMETRICS NanoSpec 2100 is an advanced inspection model that provides superior defect imaging, evaluation and production optimization capabilities, enabling a more efficient and reliable process in the creation of photomasks and ICs. With its automated defect recognition and 3D mapping capabilities, the equipment helps to reduce turnaround time and ensure accurate analysis of the manufacturing process.