Used NANOMETRICS NanoSpec 6100 #9021098 for sale
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ID: 9021098
Wafer Size: 8"
Vintage: 2000
Automated film thickness measurement system, 3" - 8"
Model no. 7000-0545 Rev P8
Measures sites as small as 10 µm in diameter
Computerized 1 µm resolution stage
Handles wafer substrates 75 mm to 300 mm in diameter
Photomasks from 5" to 9" square
Film thickness in the range of 200 Å - 30 µm
Visible light source (400 nm to 800 nm halogen lamp)
Spot size: 4x, 10x
Autofocus feature
UV wavelength range: no
OS: Microsoft Windows 98
115 VAC, 5 A, 50/60 Hz
2000 vintage.
NANOMETRICS NanoSpec 6100 is a mask and wafer inspection equipment that uses its advanced optical imaging capabilities to provide the highest resolution imaging available when inspecting semiconductor masks and wafers. This system provides a complete solution for mask and wafer inspection, enabling users to quickly and easily verify design accuracy and rules compliance during active wafer fabrication processes. NanoSpec 6100 is equipped with a variety of advanced optical imaging systems, including laser scanning confocal microscopy (LSCM) and point-projected 3D confocal microscopy (PPCM). It can image wafer types ranging from silicon dioxide (SiO2) to 4-inch epi-substrates, while offering high-resolution imaging of critical patterns on both masks and wafers. NANOMETRICS NanoSpec 6100 also comes equipped with an Arc~Link feature which allows for integration with automated inspection tools to streamline the mask and wafer inspection process. This integration allows the automatic update of a variety of parameters while also allowing for the real-time analysis of the processed inspection data. NanoSpec 6100 is capable of speed matching, allowing for faster speed throughput and improved instrument throughput reliability while also allowing for enhanced test coverage in the event of sample area changes or defects. The unit features a high-sensitivity detector machine that enables highly developed resolutions up to 0.1 micron, while accuracy of the magnification settings is further enhanced with nano-level accuracy. Furthermore, this tool is equipped with a unique double focus compensation feature which allows for optimal mask and wafer focus even with misalignments of the sample. NANOMETRICS NanoSpec 6100 also comes standard with a powerful processing engine, allowing for optimal image enhancement. This image enhancement allows for the inspection of finer patterns, and the removal of optical artifacts. With a combined inspection and metrology asset, NanoSpec 6100 is able to provide the most comprehensive solution for actively monitoring the quality of masks and wafers during their fabrication process. This model comes packed with a variety of features, allowing it to accurately inspect difficult-to-image geometries and materials. NANOMETRICS NanoSpec 6100 utilizes specialized techniques, such as polarized lighting and sweeping multiple levels of focus to provide relief of optical artifacts. The most advanced version of NanoSpec 6100 is the model M-821-RF, which features a full-field of view of 81.25 tons view, making it applicable for most mask and wafer types. In conclusion, NANOMETRICS NanoSpec 6100 is an advanced mask and wafer inspection equipment that provides the user with superior optical imaging capabilities, speed matching, nano-level accuracy, and a powerful processing engine. This system also features a variety of advanced image enhancement options, such as polarized lighting and multi-level focussing, enabling the user to inspect difficult-to-image geometries and materials. By providing the user with an integrated inspection and metrology unit, NanoSpec 6100 allows for the overall quality of masks and wafers to be monitored more closely and accurately during the fabrication process.
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