Used NANOMETRICS NanoSpec AFT 210UV #9160099 for sale
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ID: 9160099
Wafer Size: 4"
Film thickness measurement system, 4"
Stage: 4" wafers
Range of Thickness: 100 to 500,000 angstroms
Spot size: 50 um with 5x objective
25 um with 10x objective, 6.5 um with 40x objective
Objectives: Olympus MS Plan 5, MS Plan 10, ULWD MS Plan 50
Optional objectives: Olympus M5X and M100X
Film types:
Oxide on Silicon
Nitride on Silicon
Negative resist on Silicon
Poly silicon on Oxide
Negative resist on Oxide
Nitride on Oxide
Polyimide on Silicon
Positive resist on Silicon
Positive resist on Oxide
Reflectance mode:
Thick films, reproducibility: 5A ± 5% depending upon the film type
Typical measurement time: 2.5 seconds
Typical measurement time in UV mode: 10 seconds.
NANOMETRICS NanoSpec AFT 210UV is a state-of-the-art Mask and Wafer Inspection equipment designed for the highest level of inspection accuracy. The system combines advanced optics and digital imaging technology with a computer-controlled scanning unit to deliver the highest levels of inspection accuracy. The AFT 210UV provides image analysis, defect analysis, defect sizing and defect mapping at resolutions below 50 nanometers. The machine includes two linear scan stages, one galvanometric scan stage, and one discreet scan stage to produce a wide range of scan parameters and resolutions. The discreet scan stage has up to 10nm resolution and ~ 10mm2 field of view. All three stages are combined with a 12 megapixel camera which is capable of acquiring images at exceptionally high speed and accuracy. In addition, the tool includes a 16 bit digital signal processor (DSP), a field programmable gate array (FPGA) and a microcontroller to perform image capture, defect spotting and analysis in parallel. The optical engine in the AFT 210UV is designed to deliver high efficiency and high resolution for the most demanding inspection applications. The advanced optics also allow for imaging capabilities such as color, gain, focus, live views and Polarization. The AFT 210UV is equipped with advanced software and algorithms to enable automated inspection. Its advanced analytics and image processing algorithms can be used to detect small defects on wafers and masks. The asset also features advanced defect analysis algorithms to accurately identify, classify, count, size and map defects accurately on the wafers or masks. Overall, NanoSpec AFT 210UV is a powerful and reliable mask & wafer inspection tool. It has a unique combination of precise optics, ultra-high speed imaging, high resolution and advanced imaging algorithms to deliver the highest levels of inspection accuracy. The model is ideal for making critical decisions when working on advanced wafer and mask manufacturing processes.
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