Used NEXSION HV-5000C #168080 for sale

NEXSION HV-5000C is an advanced mask and wafer inspection equipment. It is used to inspect and identify small defects, wafer shape and surface defects, surface non-uniformities and process abnormalities. The system is designed for use in semiconductor manufacturing, for the high-precision detection of defects, including extremely small ones. HV-5000C offers high-speed, high-accuracy inspection in both mask and wafer applications. Its advanced optical imaging and sophisticated defect detection algorithms provide the highest level of accuracy in identifying very small defects on the surface of the mask and wafer. The unit utilizes a diffraction point distribution map that displays the reflected intensity, and has the ability to detect defects up to 25 microns, with a resolution of 5 microns. NEXSION HV-5000C is able to detect a wide range of defects, including scratches, spots, lines, pinholes, particles, burrs, and material anomalies. The machine can be configured with either a four-legged or a five-legged robot, which then sorts and extracts defective wafers, making it ideal for cost-effective production of wafers. It also comes with a comprehensive package of software tools, so the defect detection program can be tailored to meet specific inspection requirements. In addition, HV-5000C is equipped with a built-in mini-automation tool, allowing it to interface with various stage and load ports, enabling an automated process from loading to unloading and storing of wafers. It is also equipped with a remote diagnostic asset, which allows for remote monitoring of model performance and testing of components, ensuring serviceability. NEXSION HV-5000C is a powerful and reliable mask and wafer inspection equipment. Its advanced optical imaging, sophisticated defect detection algorithms, and flexibility make it the perfect choice for running accurate and reliable quality control inspections. With its built-in mini-automation system, it is the ideal choice for cost-effective automation of the processing of wafers.