Used TOPCON VI-3200 #9157679 for sale

TOPCON VI-3200 is a high-precision mask & wafer inspection equipment designed for the semiconductor industry. With automated features, the system offers advanced defect detection capabilities with quick and accurate defect isolation. The unit is designed to meet the quality and accuracy requirements of semiconductor wafer and mask inspections. The machine features a high-resolution optical microscope and Laser Induced Damage Reduction (LIDR) technology. The optical microscope provides clarity and an accuracy of up to 1nm for precise examination of the wafer, while the LIDR technology identifies and eliminates critical defects that could impact the functionality of the wafer. The advanced image processing and analysis software enables the detection of a small spot size and comes with omnidirectional surface defect detection, image edge detection, line defect detection, pattern matching, and advanced pattern detection features. Additionally, the tool offers automated measurement enablers such as optical disc detection, refresh time control, concave pattern/convex peak analysis, film thickness analysis, image element size and shape analysis and positional pattern recognition. VI-3200 also supports inspection routines such as manual SEM viewing, pushbeam, variable focus beam, and dynamic analysis. These enable the asset to accurately measure features such as flip chip bumps and solder balls, as well as metal thin film issues such as adhesion or etch rates. The model also supports image stitching and differential detection for full wafer recognition, to avoid any interference from neighboring structures. With the intuitive user interface and integrated control equipment, TOPCON VI-3200 offers easy operation and quick performance feedback. Its combination of advanced features, advanced inspection capability and ease-of-use makes it an ideal solution for a wide variety of semiconductor wafer and mask inspections.