Used TOPCON WM 1700 #293807247 for sale

TOPCON WM 1700 is a mask & wafer inspection equipment designed to provide high levels of yield and enable users to make informed decisions when developing various types of integrated circuits. It features an advanced design optimized for high performance and reliability, as well as an upgradable optics system for improved resolution. The inspection unit uses a 2048x2048 pixel array CMOS image sensor that can capture single images up to 5 megapixels. It has the ability to detect microscopic defects with the highest resolution down to 0.5μm - red, green, blue, and neutral color images can be taken simultaneously. The machine accuracy is 0.2μm and it can measure both local and global characteristics. The design of WM 1700 is focused on maximizing throughput and enabling efficient operations. The tool is powered by a 32-bit multi-core processor and features an integrated probe station with automated sample setup for speed and convenience. It has a large 11.4" sensor with superior sensitivity to detect low contrast defects, and an 8-megapixel linear CCD for bright-field images. The integrated light source is configurable for both illumination and imaging, providing users with a wide range of inspection possibilities. The asset is compatible with many popular software formats, including JEOL, TEL, and Accuracy. It supports software solutions for semiconductor mask repair and for 3D through-silicon-via (TSV) inspection. Its integrated software platform enables users to quickly access data and configure advanced inspection settings. The model is also compliant with industry-standard protocols and standards such as the interface standards for the Semiconductor Equipment and Materials International (SEMI). TOPCON WM 1700 offers an efficient, flexible, and cost-effective solution for high-end mask and wafer inspection. Its advanced design helps users meet industry demands for high-yield and reliable operations. With its improved resolution, configurable light source and wide range of compatible software formats, users can quickly and accurately evaluate micro-scale defects and perform 3D TSV inspections.