Used TOPCON WM 3 #9226701 for sale

TOPCON WM 3 is a mask and wafer inspection equipment from TOPCON Corporation used for semiconductor packaging and fabrication. The system combines optical microscope wafer inspection with a high-resolution inspection camera and a high-accuracy video projector to perform wafer defect detection and analysis. It is capable of detecting the smallest visible defects on the wafer surface, whether caused by mechanical damage, improper surface processing, or contamination. TOPCON WM-3 is a high-speed inspection unit for optical inspection and classification of standard and advanced wafer packaging formats, including mask, pad, bump, and via holes. Its four-quadrant imaging is enabled by an LCD monitor, in combination with a super high-resolution PC-based sub-sampled camera. The PC-based camera has a high-angle inclination design and a toggle switch to adjust its interpolated image resolution independently for each Sub-Sampling Auto Image Improvement (SAII) zone. For defect detection, the machine uses a high-resolution reflective type inspection camera and a double-mask design to detect a wide range of defects. The double-mask's integration with TOPCON proprietary image processing technologies provides superior defect resolution. Additionally, defect images can be saved for further analysis. WM 3 also offers an Interferometric Mask Inspection (IMI) function for inspection of transparent masks, such as pattern, backside, contact hole, and diffusion patterns. The IMI mode can inspect any pattern of mask, even when its surface morphology or other characteristics are different from other masks, such as diffraction or color variation. The tool has a built-in Video Projection Asset (VPS) to analyze defects automatically with an imaging model. The equipment can detect micron-level defects and generate detailed reports. It also has a fully automated data analysis feature which can configure an index template for mask penetration, bump, and spacing analysis. User friendly features of WM-3 include User Interface (UI), which provides an intuitive GUI for improved user productivity; data management to store and share inspection data in a shared network; and complete analysis suite to provide lumped defect groups and their position, dimensions, and characteristics. TOPCON WM 3 is an excellent tool for semiconductor wafer inspection, defect detection, and mask fabrication. It offers excellent image resolution and automatic defect analysis functions to ensure uniformity and reliability of wafer packaging and fabrication processes.